Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy

Bin Zhang; Zheng-Li Dou; Yong-Zheng Zhang; Qiang Fu; Kai Wu

doi:10.1007/s10118-024-3101-0

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Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy

RESEARCH ARTICLE | Updated：2024-06-26

- Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy
- Chinese Journal of Polymer Science Vol. 42, Issue 7, Pages: 916-925(2024)
- Affiliations：
  
  College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
- Author bio：
  
  kaiwu@scu.edu.cn
- Funds：
- DOI：10.1007/s10118-024-3101-0
  CLC：
- Received：30 December 2023，
  
  Revised：2024-02-15，
  
  Accepted：19 February 2024，
  
  Online First：18 March 2024，
  
  Published：01 July 2024
- Accepted：
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Zhang, B.; Dou, Z. L.; Zhang, Y. Z.; Fu, Q.; Wu, K. Exploring trade-offs in thermal interface materials: the impact of polymer-filler interfaces on thermal conductivity and thixotropy. Chinese J. Polym. Sci. 2024, 42, 916–925

Bin Zhang, Zheng-Li Dou, Yong-Zheng Zhang, et al. Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy[J]. Chinese Journal of Polymer Science, 2024, 42(7): 916-925.
Zhang, B.; Dou, Z. L.; Zhang, Y. Z.; Fu, Q.; Wu, K. Exploring trade-offs in thermal interface materials: the impact of polymer-filler interfaces on thermal conductivity and thixotropy. Chinese J. Polym. Sci. 2024, 42, 916–925 DOI： 10.1007/s10118-024-3101-0.

Bin Zhang, Zheng-Li Dou, Yong-Zheng Zhang, et al. Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy[J]. Chinese Journal of Polymer Science, 2024, 42(7): 916-925. DOI： 10.1007/s10118-024-3101-0.

摘要

Adept management of interfacial binding energy and transition layer thickness in thermal interface materials

via surface modification

balances thermal conductivity and thixotropy effectively.

Abstract

Effective thermal transport across solid-solid interfaces which is essential in thermal interface materials (TIMs)

necessitates both optimal thixotropy and high thermal conductivity. The role of filler surface modification

a fundamental aspect of TIM fabrication

in the influence of these properties is not fully understood. This study employs the use of a silane coupling agent (SCA) to modify alumina

integrating experimental approaches with molecular dynamics simulations

to elucidate the interface effects on thixotropy and thermal conductivity in polydimethylsiloxane (PDMS)-based TIMs. Our findings reveal that the variations of SCAs modify both interface binding energy and transition layer thickness. The interface binding energy restricts macromolecular segmental rel

axation near the interface

hindering desirable thixotropy and bond line thickness. On the contrary

the thickness of the transition layer at the interface positively influences thermal conductivity

facilitating the transport of phonons between the polymer and filler. Consequently

selecting an optimal SCA allows a balance between traditionally conflicting goals of high thermal conductivity and minimal bond line thickness

achieving an impressively low interface thermal resistance of just 2.45−4.29 K·mm

·W

−1

at 275.8 kPa.

关键词

Keywords

references

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