Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application

Wei-Jie Hong; Li-Li Yuan; Hao-Yang Zhang; Chao Cui; Wei Chen; Shi-Yong Yang

doi:10.1007/s10118-021-2636-6

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Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application

Papers | Updated：2021-11-09

- Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application
- Chinese Journal of Polymer Science Vol. 40, Issue 1, Pages: 107-120(2022)
- Affiliations：
  
  a.Key Laboratory of Science and Technology on High-tech Polymer Materials, Chinese Academy of Sciences, Beijing 100190, China
  b.School of Chemical Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
  c.Astronautical Systems Engineering Technology, Beijing 100076, China
  d.Aerospace Research Institute of Materials & Processing Technology, Beijing 100076, China
- Author bio：
  
  yuanlili@iccas.ac.cn (L.L.Y.)
  shiyang@iccas.ac.cn (S.Y.Y.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 51803222) and Science and Technology Service Network Initiative, Chinese Academy of Sciences.
- DOI：10.1007/s10118-021-2636-6
  CLC：
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Wei-Jie Hong, Li-Li Yuan, Hao-Yang Zhang, et al. Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application. [J]. Chinese Journal of Polymer Science 40(1):107-120(2022)
DOI：

Wei-Jie Hong, Li-Li Yuan, Hao-Yang Zhang, et al. Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application. [J]. Chinese Journal of Polymer Science 40(1):107-120(2022) DOI： 10.1007/s10118-021-2636-6.

摘要

Abstract

To meet the processing requirements of resin transfer moulding (RTM) technology, reactive diluent containing ,m,-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500−2500 g/mol derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,4'-oxydianiline (3,4'-ODA) and ,m,-phenylenediamine (,m,-PDA). This blend shows low minimum melting viscosity (,<,1 Pa·s) and enlarged processing temperature window (260–361 °C). FPI-R-1 stays below 1 Pa·s for 2 h at 270 °C. The relationship between the molecular weight of the blend and its melting stability was first explored. Blending oligoimides with lower molecular weights exhibit better melting stability. Upon curing at 380 °C for 2 h, the thermosetting polyimide resin demonstrates superior heat resistance (,T,g,=420−426 °C).

关键词

Keywords

OligoimideResin transfer moldingReactive diluentMelting stability

references

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