Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites

Zhen-Yu Wang; Tong Zhao; Shuo Meng; Xiao-Long Wang; Ying Sun; Yuan-Tao Zhang

doi:10.1007/s10118-025-3360-4

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Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites

RESEARCH ARTICLE | Updated：2025-07-26

- Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites
- Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites
- 高分子科学（英文） 2025年43卷第8期页码：1443-1457
- Affiliations：
  
  School of Electrical Engineering, Shandong University, Jinan 250061, China
- Author bio：
  
  zhaotong@sdu.edu.cn
- Funds：
  
  This work was financially supported by the Natural Science Foundation of Shandong Province (No. ZR2021ME011) and State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources (No. LAPS20001).
- DOI：10.1007/s10118-025-3360-4
  中图分类号：
- 收稿：2025-02-12，
  
  修回：2025-03-26，
  
  录用：2025-04-15，
  
  网络首发：2025-06-30，
  
  纸质出版：2025-08-01
- Accepted：
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Wang, Z. Y.; Zhao, T.; Meng, S.; Wang, X. L.; Sun, Y.; Zhang, Y. T. Key physicochemical properties and service characteristics of low dielectric polyimide-based nanocomposites. Chinese J. Polym. Sci. 2025, 43, 1443–1457

Zhen-Yu Wang, Tong Zhao, Shuo Meng, et al. Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites[J]. Chinese Journal of Polymer Science, 2025, 43(8): 1443-1457.
Wang, Z. Y.; Zhao, T.; Meng, S.; Wang, X. L.; Sun, Y.; Zhang, Y. T. Key physicochemical properties and service characteristics of low dielectric polyimide-based nanocomposites. Chinese J. Polym. Sci. 2025, 43, 1443–1457 DOI： 10.1007/s10118-025-3360-4.

Zhen-Yu Wang, Tong Zhao, Shuo Meng, et al. Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites[J]. Chinese Journal of Polymer Science, 2025, 43(8): 1443-1457. DOI： 10.1007/s10118-025-3360-4.

摘要

POSS-doped polyimide nanocomposites exhibit reduced dielectric constants (2.6)

enhanced thermal conductivity

and improved mechanical properties. Chemical bonding outperforms physical blending

offering better performance and sustainability by reducing CO emissions under high-temperature and electric field conditions.

Abstract

In high-frequency electrical energy systems

polyimide (PI) composite insulation materials need to possess a low dielectric constant

sufficient thermal conductivity

and robust interfacial adhesion to ensure reliable performance under elevated temperatures and pressures. These aspects are crucial for preventing local overheating and electrical breakdown

thereby ensuring reliable equipment operation. Traditional PI insulation materials often exhibit high dielectric constants and pronounced dielectric losses

compromising their insulation efficiency. In this study

molecular dynamics simulations were employed to incorporate polyhedral oligomeric silsesquioxanes (POSS) into PI through physical blending and chemical bonding to enhance dielectric properties. Key parameters of the PI/POSS composite system

including dielectric constant

thermal conductivity

glass transition

temperature

Young’s modulus

Poisson’s ratio

and interfacial adhesion energy

were systematically evaluated for both doping methods. The degradation behavior of the PI composites under high-temperature and electric field conditions was also simulated to elucidate degradation pathways and product distributions

providing insights for designing low-dielectric insulation materials. Doping with POSS significantly reduces the dielectric constant of PI

thereby improving insulation performance

thermal stability

mechanical strength

and interfacial adhesion. At an optimal POSS doping ratio

the thermal conductivity of PI is enhanced. Compared with the physical blending system

the chemical bonding system yields more substantial improvements across all evaluated properties. Under high-temperature and strong electric field conditions

POSS doping enhances interfacial adhesion and thermal stability

effectively suppressing the cleavage of key chemical bonds

reducing

$$ \mathrm{CO} $$

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emissions

and increasing the formation of oxygen-containing intermediates and water molecules

which contributes to improved environmental sustainability.

关键词

Keywords

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