Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-<italic style="font-style: italic">k</italic> Polyimide

Wan-Jing Zhao; Yi-Zhang Tong; Pei-Pei Zeng; Yang-Sheng Zhou; Xian-Wu Cao; Wei Wu

doi:10.1007/s10118-024-3186-5

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Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide

RESEARCH ARTICLE | Updated：2024-11-04

- Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide
- Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide
- 高分子科学（英文版） 2024年42卷第11期页码：1824-1834
- Affiliations：
  
  a.National Engineering Research Center of Novel Equipment for Polymer Processing, Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
  b.Engineering Center for Superlubricity, Jihua Laboratory, Foshan 528200, China
  c.Guangdong Provincial Key Laboratory of Distributed Energy Systems, Guangdong Provincial Engineering Research Center of Distributed Energy Systems, Dongguan University of Technology, Dongguan 523808, China
- Author bio：
  
  ppeme@scut.edu.cn (X.W.C.)
  scutw.wei@gmail.com (W.W.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 52103029).
- DOI：10.1007/s10118-024-3186-5
  中图分类号：
- 纸质出版日期：2024-11-30，
  
  网络出版日期：2024-09-18，
  
  收稿日期：2024-04-17，
  
  修回日期：2024-05-13，
  
  录用日期：2024-06-06
- Accepted：
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Zhao, W. J.; Tong, Y. Z.; Zeng, P. P.; Zhou, Y. S.; Cao, X. W.; Wu, W. Comparative study of intrachain versus interchain cross-linking on the mechanical, thermal and dielectric properties of low-k polyimide. Chinese J. Polym. Sci. 2024, 42, 1824–1834

Wan-Jing Zhao, Yi-Zhang Tong, Pei-Pei Zeng, et al. Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide. [J]. Chinese Journal of Polymer Science, 2024,42(11):1824-1834.
Zhao, W. J.; Tong, Y. Z.; Zeng, P. P.; Zhou, Y. S.; Cao, X. W.; Wu, W. Comparative study of intrachain versus interchain cross-linking on the mechanical, thermal and dielectric properties of low-k polyimide. Chinese J. Polym. Sci. 2024, 42, 1824–1834 DOI： 10.1007/s10118-024-3186-5.

Wan-Jing Zhao, Yi-Zhang Tong, Pei-Pei Zeng, et al. Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide. [J]. Chinese Journal of Polymer Science, 2024,42(11):1824-1834. DOI： 10.1007/s10118-024-3186-5.

摘要

Comparative analysis of the influence of intrachain and interchain cross-linking structures on the dielectric of PI. Remarkably

PI films with an intrachain cross-linking structure exhibit a lower dielectric constant and dielectric loss compared to PI films with an interchain cross-linking structure.

Abstract

Polyimide (PI) is widely used in high-frequency communication technology due to its exceptional comprehensive properties. However

traditional PI has a relatively elevated dielectric constant and dielectric loss. Herein

the different cross-linked structures were introduced in PI matrix and conducted a detailed discussion on the influence of cross-linking agent content and cross-linking structure type on the overall performance of PI films. In comparison to the dielectric constant of 2.9 of neat PI

PI with an interchain cross-linking structure containing 2 wt% 1

5-tris(4-aminophenyl)benzene (TAPB) (interchain-PI-2) exhibited the reduced dielectric constant of 2.55 at 1 MHz. The PI films with intrachain cross-linking structure containing 2 wt% TAPB (intrachain-PI-2) exhibited the lowest dielectric constant of 2.35 and the minimum dielectric loss of 0.0075 at 1 MHz. It was due to the more entanglement junctions of intrachain-PI resulting in decreased carrier transport. The thermal expansion coefficients of both interchain-PI and intrachain-PI films were effectively reduced. Moreover

in contrast to interchain-PI films

the intrachain-PI films maintained colorlessness and transparency as the cross-linking agent content increased. This work compared the effects of two different cross-linked structures on the performance of PI films and provided a feasible way to obtain low-

PI films with excellent comprehensive performance for 5G applications.

关键词

Keywords

Interchain cross-linkingIntrachain cross-linkingPolyimideLow dielectric

references

Li, X.; Liu, T.; Jiao, Y.; Dong, J.; Gan, F.; Zhao, X.; Zhang, Q. Novel high-performance poly(benzoxazole-co-imide) resins with low dielectric constants and superior thermal stabilities derived from thermal rearrangement ofortho-hydroxy polyimide oligomers.Chem. Eng. J.2019,359, 641−651..

Zhang, P.; Zhao, J.; Zhang, K.; Bai, R.; Wang, Y.; Hua, C.; Wu, Y.; Liu, X.; Xu, H.; Li, Y. Fluorographene/polyimide composite films: mechanical, electrical, hydrophobic, thermal and low dielectric properties.Compos. Part A Appl. Sci. Manuf.2016,84, 428−434..

Wu, Z.; Peng, Y.; Song, Y.; Liang, H.; Gong, L.; Liu, Z.; Zhang, Q.; Chen, Y. Polyimide dielectrics with cross-linked structure for high-temperature film capacitors.Mater. Today Energy2023,32, 101243..

Zhou, H.; Lei, H.; Wang, J.; Qi, S.; Tian, G.; Wu, D. Breaking the mutual restraint between low permittivity and low thermal expansion in polyimide filmsviaa branched crosslink structure.Polymer2019,162, 116−120..

Hu, K.; Ye, Q.; Fan, Y.; Nan, J.; Chen, F.; Gao, Y.; Shen, Y. Preparation and characterization of organic soluble polyimides with low dielectric constant containing trifluoromethyl for optoelectronic application.Eur. Polym. J.2021,157, 110566..

Chen, Z.; Zhou, Y.; Wu, Y.; Liu, S.; Huang, H.; Zhao, J. Fluorinated polyimide with polyhedral oligomeric silsesquioxane aggregates: Toward low dielectric constant and high toughness.Compos. Sci. Technol.2019,181, 107700..

Zhao, W.; Wei, Z.; Lu, C.; Tong, Y.; Huang, J.; Cao, X.; Shi, D.; Li, R. K. Y.; Wu, W. Construction of all-organic low dielectric polyimide hybridsviasynergistic effect between covalent organic framework and cross-linking structure.Nano Mater. Sci.2023,5, 429−438..

Li, H.; Kong, X.; Wang, S.; Gong, M.; Lin, X.; Zhang, L.; Wang, D. Sustainable dielectric films with ultralow permittivity from soluble fluorinated polyimide.Molecules2023,28, 1−12..

Xie, M.; Li, M.; Sun, Q.; Fan, W.; Xia, S.; Fu, W. Research progress on porous low dielectric constant materials.Mater. Sci. Semicond. Process.2022,139, 106320..

Zhou, Y.; Zhang, Z.; Wang, P.; Ma, X. High-performance and low-dielectric cyanate ester resin optimized by regulating the structure of linear polyhydroxy ether modifier.Compos. Part A Appl. Sci. Manuf.2022,162, 107136..

Wu, Y.; Chen, Z.; Ji, J.; Zhou, Y.; Huang, H.; Liu, S.; Zhao, J. Multifunctional polyimides by direct silyl ether reaction of pendant hydroxy groups: toward low dielectric constant, high optical transparency and fluorescence.Eur. Polym. J.2020,132, 109742..

Zhao, W.; Tong, Y.; Lu, C.; Huang, Q.; Cao, X.; Li, R. K. Y.; Wu, W. Bioinspired construction of size adjustable hollow polydopamine microspheres for ultra-low dielectric polyimide composites.Appl. Surf. Sci.2024,643, 158714..

Zhao, W.; Lu, C.; Zhao, H.; Huang, J.; Zha, J. W.; Cao, X.; Li, R. K. Y.; Wu, W. Achieving hydrophobic ultralow dielectric constant polyimide composites: Combined efforts of fluorination and porous fillers.Macromol. Mater. Eng.2022,307, 1−12..

Tian, P.; Yang, S.; Liu, W.; Zhang, J. Acrylamide-modified polyvinyl alcohol and combined with graphene oxide for low dielectric constant composite films.Colloids Surfaces A Physicochem. Eng. Asp.2022,648, 129136..

Li, H.; Bao, F.; Lan, X.; Li, S.; Zhu, H.; Li, Y.; Wang, M.; Zhu, C.; Xu, J. Fluorinated polyimide with triphenyl pyridine structure for 5G communications: low dielectric, highly hydrophobic, and highly transparent.Eur. Polym. J.2023,197, 112327..

Li, D.; Lu, Z.; Ke, Z.; Xu, K.; Dai, F.; Yu, Y.; Qian, G.; Chen, C. Moisture resistant polyimide aerogel membranes with low dielectric constant and super thermal insulation for electronic device under harsh environment.Polymer2024,290, 126478..

Zhang, C.; Lv, Q.; Liu, Y.; Wang, C.; Wang, Q.; Wei, H.; Liu, L.; Li, J.; Dong, H. Rational design and fabrication of lightweight porous polyimide composites containing polyaniline modified graphene oxide and multiwalled carbon nanotube hybrid fillers for heat-resistant electromagnetic interference shielding.Polymer2021,224, 123742..

Kourakata, Y.; Onodera, T.; Kasai, H.; Jinnai, H.; Oikawa, H. Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes.Polymer2021,212, 123115..

Yang, K.; Kang, Y. Y.; Ahn, H. J.; Kim, D. G.; Park, N. K.; Choi, S. Q.; Won, J. C.; Kim, Y. H. Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric propertiesviahigh internal phase Pickering emulsion method.J. Ind. Eng. Chem.2020,82, 173−179..

Chen, Z.; Liu, S.; Yan, S.; Shu, X.; Yuan, Y.; Huang, H.; Zhao, J. Overall improvement in dielectric and mechanical properties of porous graphene fluoroxide/polyimide nanocomposite filmsviabubble-stretching approach.Mater. Des.2017,117, 150−156..

Zhao, W.; Cao, X.; Huang, J.; Wen, J.; He, Y.; Zha, J.; Li, R. K. Y.; Wu, W. Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties.Express Polym. Lett.2022,16, 142−151..

Fan, H.; Xie, T.; Wang, C.; Zhang, Y.; Pan, S.; Li, J.; Zhang, Y.; Guan, S.; Yao, H. Low-dielectric polyimide constructed by integrated strategy containing main-chain and crosslinking network engineering.Polymer2023,279, 126035..

Song, N.; Yao, H.; Ma, T.; Wang, T.; Shi, K.; Tian, Y.; Zhang, B.; Zhu, S.; Zhang, Y.; Guan, S. Decreasing the dielectric constant and water uptake by introducing hydrophobic cross-linked networks into co-polyimide films.Appl. Surf. Sci.2019,480, 990−997..

Li, X.; Zhang, P.; Dong, J.; Gan, F.; Zhao, X.; Zhang, Q. Preparation of low-κ polyimide resin with outstanding stability of dielectric properties versus temperature by adding a reactive cardo-containing diluent.Compos. Part B Eng.2019,177, 107401..

Guo, F.; Shen, X.; Zhou, J.; Liu, D.; Zheng, Q.; Yang, J.; Jia, B.; Lau, A. K. T.; Kim, J. K. Highly thermally conductive dielectric nanocomposites with synergistic alignments of graphene and boron nitride nanosheets.Adv. Funct. Mater.2020,30, 1−13..

Han, S.; Li, Y.; Hao, F.; Zhou, H.; Qi, S.; Tian, G.; Wu, D. Ultra-low dielectric constant polyimides: combined efforts of fluorination and micro-branched crosslink structure.Eur. Polym. J.2021,143, 110206..

Cashman, J. L.; Nguyen, B. N.; Dosa, B.; Meador, M. A. B. Flexible polyimide aerogels derived from the use of a neopentyl spacer in the backbone.ACS Appl. Polym. Mater.2020,2, 2179−2189..

Bei, R.; Qian, C.; Zhang, Y.; Chi, Z.; Liu, S.; Chen, X.; Xu, J.; Aldred, M. P. Intrinsic low dielectric constant polyimides: relationship between molecular structure and dielectric properties.J. Mater. Chem. C2017,5, 12807−12815..

Li, Z.; An, L.; Khuje, S.; Tan, J.; Hu, Y.; Huang, Y.; Petit, D.; Faghihi, D.; Yu, J.; Ren, S. Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation.Sci. Adv. 2021 ,7, 1–8..

Wu, Y.; Ji, J.; Huang, H.; Liu, S.; Zhao, J. Facile synthesis of acyloxy-containing fluorene-based Cardo polyimides with high optical transparency, fluorescence and low dielectric constant.React. Funct. Polym.2021,166, 104979..

Choi, H.; Kim, T.; Kim, T.; Moon, S.; Yoo, S. H.; Parale, V. G.; Dhavale, R. P.; Kang, K.; Sohn, H.; Park, H. H. Ultralow dielectric cross-linked silica aerogel nanocomposite films for interconnect technology.Appl. Mater. Today2022,28, 101536..

Huang, X.; Wang, J.; Li, Q.; Lin, J.; Wang, Z. Impact of the phenyl thioether contents on the high frequency dielectric loss characteristics of the modified polyimide films.Surf. Coatings Technol.2019,360, 205−212..

Sharifi, S.; Asenjo-Sanz, I.; Pomposo, J. A.; Alegria, A. Intra- vs intermolecular cross-links in poly(methyl methacrylate) networks containing enamine bonds.Macromolecules2021,55, 3627−3636..

Zuo, H. T.; Gan, F.; Dong, J.; Zhang, P.; Zhao, X.; Zhang, Q. H. Highly transparent and colorless polyimide film with low dielectric constant by introducing meta-substituted structure and trifluoromethyl groups.Chinese J. Polym. Sci.2021,39, 455−464..

Song, N.; Shi, K.; Yu, H.; Yao, H.; Ma, T.; Zhu, S.; Zhang, Y.; Guan, S. Decreasing the dielectric constant and water uptake of co-polyimide films by introducing hydrophobic cross-linked networks.Eur. Polym. J.2018,101, 105−112..

Mao, L.; Ma, L.; Fu, Y.; Chen, H.; Dai, H.; Zhu, H.; Wang, H.; Yu, Y.; Zhang, Y. Transglutaminase modified type a gelatin gel: the influence of intra-molecular and inter-molecular cross-linking on structure-properties.Food Chem.2022,395, 133578..

Tian, Y.; Luo, L.; Yang, Q.; Zhang, L.; Wang, M.; Wu, D.; Wang, X.; Liu, X. Construction of stable hydrogen bonds at high temperature for preparation of polyimide films with ultralow coefficient of thermal expansion and highTg.Polymer2020,188, 122100..

Wu, T.; Dong, J.; De France, K.; Li, M.; Zhao, X.; Zhang, Q. Fabrication of polyimide aerogels cross-linked by a cost-effective amine-functionalized hyperbranched polysiloxane (NH2-HBPSi).ACS Appl. Polym. Mater.2020,2, 3876–3885..

Zhang, X.; Zhang, Y.; Zhang, X.; Guo, S. Interface design and dielectric response behavior of SiO2/PB composites with low dielectric constant and ultra-low dielectric loss.Surfaces and Interfaces2021,22, 100807..

Gao, H.; Yorifuji, D.; Jiang, Z.; Ando, S. Thermal and optical properties of hyperbranched fluorinated polyimide/mesoporous SiO2nanocomposites exhibiting high transparency and reduced thermo-optical coefficients.Polymer2014,55, 2848–2855..

Li, X.; Lei, H.; Guo, J.; Wang, J.; Qi, S.; Tian, G.; Wu, D. Composition design and properties investigation of BPDA/PDA/TFDB co-polyimide films with low dielectric permittivity.J. Appl. Polym. Sci.2019,136, 1–10..

Yin, Q.; Qin, Y.; Lv, J.; Wang, X.; Luo, L.; Liu, X. Reducing intermolecular friction work: preparation of polyimide films with ultralow dielectric loss from MHz to THz frequency.Ind. Eng. Chem. Res.2022,61, 17894–−17903..

Zhao, K.; Khan, H. U.; Li, R.; Su, Y.; Amassian, A. Entanglement of conjugated polymer chains influences molecular self-assembly and carrier transport.Adv. Funct. Mater.2013,23, 6024–6035..

Wu, S. Chain structure and entanglement.J. Polym. Sci. Part B Polym. Phys.1989,27, 723–741..

Galant, O.; Bae, S.; Wang, F.; Levy, A.; Silberstein, M. N.; Diesendruck, C. E. Mechanical and thermomechanical characterization of glassy thermoplastics with intrachain cross-links.Macromolecules2017,50, 6415–6420..

Chen, J.; Garcia, E. S.; Zimmerman, S. C. Intramolecularly cross-linked polymers: from structure to function with applications as artificial antibodies and artificial enzymes.Acc. Chem. Res.2020,53, 1244–1256..

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Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide

DOI：10.1007/s10118-024-3186-5

摘要

Abstract

关键词

Keywords

references