Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials

Yuan Ji; Shi-Da Han; Hong Wu; Shao-Yun Guo; Feng-Shun Zhang; Jian-Hui Qiu

doi:10.1007/s10118-023-3023-2

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Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials

RESEARCH ARTICLE | Updated：2024-02-20

- Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials
- Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials
- 高分子科学（英文版） 2024年42卷第3期页码：352-363
- Affiliations：
  
  a.The State Key Laboratory of Polymer Materials Engineering, Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing Technology, Polymer Research Institute, Sichuan University, Chengdu 610065, China
  b.Institute of Chemical Materials, China Academy of Engineering Physics, Mianyang 621900, China
  c.Department of Mechanical Engineering, Faculty of Systems Science and Technology, Akita Prefectural University, Akita 015-0055, Japan
- Author bio：
  
  wh@scu.edu.cn
- Funds：
  
  This work was financially supported by Sichuan Science and Technology Program (No. 2022YFH0090) and the Fundamental Research Funds for the Central Universities.
- DOI：10.1007/s10118-023-3023-2
  中图分类号： M
- 收稿：2023-05-29，
  
  修回：2023-6-19，
  
  录用：2023-6-27，
  
  网络首发：2023-08-22，
  
  纸质出版：2024-03-01
- Accepted：
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Ji, Y.; Han, S. D.; Wu, H.; Guo, S. Y.; Zhang, F. S.; Qiu, J. H. Understanding the thermal impedance of silicone rubber/hexagonal boron nitride composites as thermal interface materials. Chinese J. Polym. Sci. 2024, 42, 352–363

Yuan Ji, Shi-Da Han, Hong Wu, et al. Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials[J]. Chinese Journal of Polymer Science, 2024, 42(3): 352-363.
Ji, Y.; Han, S. D.; Wu, H.; Guo, S. Y.; Zhang, F. S.; Qiu, J. H. Understanding the thermal impedance of silicone rubber/hexagonal boron nitride composites as thermal interface materials. Chinese J. Polym. Sci. 2024, 42, 352–363 DOI： 10.1007/s10118-023-3023-2.

Yuan Ji, Shi-Da Han, Hong Wu, et al. Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials[J]. Chinese Journal of Polymer Science, 2024, 42(3): 352-363. DOI： 10.1007/s10118-023-3023-2.

摘要

In this paper

the thermal impedance of SR composites loaded with different levels of hexagonal boron nitride as TIMs was elaborated. It is found that the thermal impedance of the SR composites depends on the thermal conductivity

contact resistance and BLT. Besides

the elastic modulus and surface roughness of the SR composites increased with the increase of hexagonal boron nitride content

indicating that the conformity was reduced.

Abstract

Silicone rubber (SR) composites are most widely used as thermal interface materials (TIMs) for electronics heat dissipation. Thermal impedance as the main bottleneck limiting the performance of TIMs is usually neglected. Herein

the thermal impedance of SR composites loaded with different levels of hexagonal boron nitride (h-BN) as TIMs was elaborated for the first time by the ASTM D 5470 standard test and finite element analysis. It was found that elastic modulus and surface roughness of SR composites increased with the increase of h-BN content

indicating that the conformity was reduced. When the assembly pressure was 0.69 MPa

there existed an optimal h-BN content at which the contact resistance was minimum (0.39 K·cm

·W

−1

). Although the decreased bond line thickness (BLT) by increasing the assembly pressure was beneficial to reduce the thermal impedance

the proper assembly pressure should be selected to prevent the warpage of the contact surfaces and the increase in contact resistance

according to the compression properties of the SR composites. This study provides valuable insights into fabrication of high-performance TIMs for modern electronic device applications.

关键词

Keywords

references

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