Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives

Yong Wei; Yang Mei; Min Wu; Song Chen; Lan Liu

doi:10.1007/s10118-023-2913-7

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Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives

RESEARCH ARTICLE | Updated：2023-06-14

- Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives
- Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives
- 高分子科学（英文版） 2023年41卷第7期页码：1142-1154
- Affiliations：
  
  a.School of Materials Science and Engineering, Engineering Research Center of Biomass Materials, Ministry of Education, Southwest University of Science and Technology, Mianyang 621010, China
  b.College of Materials Science and Engineering, Key Lab of Guangdong Province for High Property and Functional Macromolecular Materials, South China University of Technology, Guangzhou 510641, China
- Author bio：
  
  msweiyong@swust.edu.cn (Y.W.)
  chensong@scut.edu.cn (S.C.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 52103097), the Doctor Foundation of Southwest University of Science and Technology (No. 20zx7144), the Special Foundation for Young Scientists of Sichuan Province (No. 71112541), the Guangdong Natural Science Foundation (No. 2021A1515010675), the Key Project of Guangzhou Science and Technology Plan Project (No. 201904020034) and the Guangdong Project of R&D Plan in Key Areas (No. 2020B010180001).;Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-023-2913-7.
- DOI：10.1007/s10118-023-2913-7
  中图分类号：
- 收稿：2022-10-17，
  
  修回：2022-11-9，
  
  录用：2022-11-25，
  
  网络首发：2023-02-01，
  
  纸质出版：2023-07-01
- Accepted：
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Wei, Y.; Mei, Y.; Wu, M.; Chen, S.; Liu, L. Electrically detaching behavior and mechanism of ionic conductive adhesives. Chinese J. Polym. Sci. 2023, 41, 1142–1154

Yong Wei, Yang Mei, Min Wu, et al. Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives[J]. Chinese Journal of Polymer Science, 2023, 41(7): 1142-1154.
Wei, Y.; Mei, Y.; Wu, M.; Chen, S.; Liu, L. Electrically detaching behavior and mechanism of ionic conductive adhesives. Chinese J. Polym. Sci. 2023, 41, 1142–1154 DOI： 10.1007/s10118-023-2913-7.

Yong Wei, Yang Mei, Min Wu, et al. Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives[J]. Chinese Journal of Polymer Science, 2023, 41(7): 1142-1154. DOI： 10.1007/s10118-023-2913-7.

摘要

In this work

the fast electrically detaching behavior (100% detaching efficiency in just 1 min) of epoxy-based ionic conductive adhesives (ICAs) with ultra-high initial bonding strength (>12 MPa) is represented and the electrically detaching mechanism is clarified.

Abstract

Design of rapidly detachable adhesives with high initial bonding strength is of great significance but it is full of great challenge. Here

we report the fast electrically detaching behavior (100% detaching efficiency in just 1 min under dozens of DC voltage) and high initial bonding strength (

12 MPa) of epoxy-based ionic conductive adhesives (ICAs). The epoxy-based ICAs are fabricated by introducing polyethylene glycol dimethyl ether (PEGDE) and 1-ethyl-3-methylimidazolium trifluoromethanesulfonate ([EMIM]OTF) into epoxy. The combination of PEGDE and [EMIM]

OTF enables the free ions to migrate directively in electric field

and the anchoring of PEG chains onto epoxy chains ensures the long-term reliability of ICAs. The investigation on the electrically detaching mechanism suggests that the enrichment and following rapid interfacial electrochemical reactions of [EMIM]OTF lead to formation of metal hydroxide (Me(OH)

) nanoparticles at the bonding interfaces

thus the strong interactions containing interlocked forces

van de Waals’ forces and hydrogen bonding interactions between ICAs and bonding substrates are destroyed. This work provides a promising direction for detachable adhesives with both high initial bonding strength and high detaching efficiency in short time.

关键词

Keywords

references

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