Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness

Chang-Ou Wang; Lei Zhai; Song Mo; Yi Liu; Meng-Yan Gao; Yan Jia; Min-Hui He; Lin Fan

doi:10.1007/s10118-022-2785-2

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Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness

RESEARCH ARTICLE | Updated：2022-11-16

- Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness
- Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness
- 高分子科学（英文版） 2022年40卷第12期页码：1651-1661
- Affiliations：
  
  a.Key Laboratory of Science and Technology on High-tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  b.School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China
- Author bio：
  
  zhailei@iccas.ac.cn (L.Z.)
  fanlin@iccas.ac.cn (L.F.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 51803221).;Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-022-2785-2.
- DOI：10.1007/s10118-022-2785-2
  中图分类号：
- 收稿：2022-03-25，
  
  修回：2022-4-12，
  
  录用：2022-4-28，
  
  网络首发：2022-07-21，
  
  纸质出版：2022-12-01
- Accepted：
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Wang, C. O.; Zhai, L.; Mo, S.; Liu, Y.; Gao, M. Y.; Jia, Y.; He, M. H.; Fan, L. Effect of aggregation structure on thermal expansion behavior of polyimide films with different thickness. Chinese J. Polym. Sci. 2022, 40, 1651–1661

Chang-Ou Wang, Lei Zhai, Song Mo, et al. Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness[J]. Chinese Journal of Polymer Science, 2022, 40(12): 1651-1661.
Wang, C. O.; Zhai, L.; Mo, S.; Liu, Y.; Gao, M. Y.; Jia, Y.; He, M. H.; Fan, L. Effect of aggregation structure on thermal expansion behavior of polyimide films with different thickness. Chinese J. Polym. Sci. 2022, 40, 1651–1661 DOI： 10.1007/s10118-022-2785-2.

Chang-Ou Wang, Lei Zhai, Song Mo, et al. Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness[J]. Chinese Journal of Polymer Science, 2022, 40(12): 1651-1661. DOI： 10.1007/s10118-022-2785-2.

摘要

Thermal expansion behavior of polyimide films

derived from PMDA/ODA with different thickness

was significantly affected by aggregation structures. It is primarily dependent on molecular chain orientation and packing along in-plane or out-of-plane directions. It is revealed that thermal expansion of 5 μm film may be largely influenced by chain packing.

Abstract

Polyimide films derived from representative PMDA/ODA were prepared with thickness ranging from 5 μm to 25 μm

and the effect of aggregation structure on thermal expansion behavior along different directions was studied. Both in-plane and out-of-plane linear thermal expansion (CTE

and CTE

$$_\perp $$

http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=36805592&type=

) were respectively characterized by thermal mechanical analysis and FT-near-IR interference method. Volumetric and anisotropic behavior of thermal expansion were also investigated. With increasing film thickness

CTE

gradually increased from 32.2 ppm/°C to 46.1 ppm/°C while CTE

$$_\perp $$

http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=36805596&type=

decreased from 149.7 ppm/°C to 128.2 ppm/°C. Volumetric thermal expansion of polyimide films was less sensitive to the varied thickness

but anisotropy of thermal expansion was reduced. Polyimide film of 5 μm thickness showed large birefringence

indicating more considerable in-plane chain orientation anisotropy. Besides

molecular chains were more densely packed along in-plane direction when film thickness increased

while became loosely stacked in the out-of-plane direction. In contrast to the enhanced lateral chain packing for thicker films

higher vertical chain packing order was found in thinner films. The variation of aggregation structure during thermal expansion procedure was analyzed by temperature-dependent WAXD. It is proved that thermal expansion behavior of thinner films could be largely attributed to molecular chain packing

whereas that may be influenced by many factors for thicker films in addition to the effect of chain packing. The results revealed that thermal expansion of films with thickness variation is closely related to molecular chain orientation and packing

which is associated with both chemistry and morphological structure of polyimide.

关键词

Keywords

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