Palladium-assisted Metal Patterning on Polyimide Surfaces

Shi-Long Zhong; Bai-Yang Zhou; Xi-Rui Gu; Ding-Shan Yu; Xu-Dong Chen

doi:10.1007/s10118-022-2778-1

Your Location：

Home >

Browse articles >

Palladium-assisted Metal Patterning on Polyimide Surfaces

RESEARCH ARTICLE | Updated：2022-09-23

- Palladium-assisted Metal Patterning on Polyimide Surfaces
- Palladium-assisted Metal Patterning on Polyimide Surfaces
- Chinese Journal of Polymer Science 2022年40卷第10期页码：1287-1296
- Affiliations：
  
  Key Laboratory for Polymeric Composite and Functional Materials of Ministry of Education, Key Laboratory of High Performance Polymer-based Composites of Guangdong Province, School of Chemistry, Sun Yat-sen University, Guangzhou 510275, China
- Author bio：
  
  yudings@mail.sysu.edu.cn (D.S.Y.)
  cescxd@mail.sysu.edu.cn (X.D.C.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 51833011) and the National Key Research and Development Program of China (No. 2016YT03C077).;Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-022-2778-1.
- DOI：10.1007/s10118-022-2778-1
  中图分类号：
- 收稿：2022-01-29，
  
  修回：2022-3-4，
  
  录用：2022-4-25，
  
  网络首发：2022-07-21，
  
  纸质出版：2022-10-01
- Accepted：
Scan QR Code
Zhong, S. L.; Zhou, B. Y.; Gu, X. R.; Yu, D. S.; Chen, X. D. Palladium-assisted metal patterning on polyimide surfaces. Chinese J. Polym. Sci. 2022, 40, 1287–1296

Shi-Long Zhong, Bai-Yang Zhou, Xi-Rui Gu, et al. Palladium-assisted Metal Patterning on Polyimide Surfaces[J]. Chinese Journal of Polymer Science, 2022, 40(10): 1287-1296.
Zhong, S. L.; Zhou, B. Y.; Gu, X. R.; Yu, D. S.; Chen, X. D. Palladium-assisted metal patterning on polyimide surfaces. Chinese J. Polym. Sci. 2022, 40, 1287–1296 DOI： 10.1007/s10118-022-2778-1.

Shi-Long Zhong, Bai-Yang Zhou, Xi-Rui Gu, et al. Palladium-assisted Metal Patterning on Polyimide Surfaces[J]. Chinese Journal of Polymer Science, 2022, 40(10): 1287-1296. DOI： 10.1007/s10118-022-2778-1.

摘要

Based on the coordination affinity of nitrogen to palladium

the palladium-assisted metal patterning on polyimide films was achieved by the electroless plating. The Cu patterns on the films have a minimum line width of 50 µm

minimum line spacing of 20 µm

and low resistivity of 1.78 µΩ·cm.

Abstract

A novel method of patterning high precision copper conductive micropatterns on flexible polymer substrate (polyimide) is developed. We utilized the coordination effect between palladium salts and pyridine structures to fix the palladium chloride (PdCl

) on the surface of polymer film while the 2

6-dimethylpyridine structures formed in the specific areas under ultraviolet light guaranteed the resolution of final patterns. Simultaneous thermal reduction of PdCl

on the surface can be achieved in the process of thermal cyclization of the polymer substrate. As a consequence

the obtained polyimide (PI) film can be patterned with conductive copper micropatterns directly by electroless plating. In particular

we accomplished the deposition of high precision copper pattern with a minimum line width of 50 µm and minimum line spacing of 20 µm on PI thin films (thickness ~10 μm) by electroless plating. The prepared conductive copper micropatterns exhibit a low resistivity of 1.78 µΩ·cm the same as the pure block copper. And the relationship between the structures of the polymer chains and the physical properties of polymer substrates

such as the dimensional stability

mechanical and dielectric properties were also discussed in detail. This simple and novel method of patterning metal on the polymer surface does not need to achieve the catalytic metal adhesion required for electroless plating at the cost of destroying the substrate surface and avoiding the introduction of unstable interlayers. This patterning method is compatible with the current roll-to-roll production process and can be used to develop high-performance micro-integrated circuits.

关键词

Keywords

references

Ji, D.; Li, T.; Zou, Y.; Chu, M.; Zhou, K.; Liu, J.; Tian, G.; Zhang, Z.; Zhang, X.; Li, L.; Wu, D.; Dong, H.; Miao, Q.; Fuchs, H.; Hu, W . Copolymer dielectrics with balanced chain-packing density and surface polarity for high-performance flexible organic electronics . Nat. Commun. , 2018 . 9 2339 DOI: 10.1038/s41467-018-04665-z http://doi.org/10.1038/s41467-018-04665-z .

Kaltenbrunner, M.; Sekitani, T.; Reeder, J.; Yokota, T.; Kuribara, K.; Takeyoshi, T.; Michael, D.; Reinhard, S.; Ingrid, G.; Simona, B.; Siegfried, B.; Takao, S . An ultra-lightweight design for imperceptible plastic electronics . Nature , 2013 . 499 458 - 463 . DOI: 10.1038/nature12314 http://doi.org/10.1038/nature12314 .

Choi, S.; Kim, S.; Kim, I . Ultrafast optical reduction of graphene oxide sheets on colorless polyimide film for wearable chemical sensors . NPG Asia Mater. , 2016 . 8 e315 DOI: 10.1038/am.2016.150 http://doi.org/10.1038/am.2016.150 .

Ji, D.; Jiang, L.; Cai, X.; Dong, H.; Meng, Q.; Tian, G.; Wu, D.; Li, J.; Hu, W . Large scale, flexible organic transistor arrays and circuits based on polyimide materials . Org. Electron. , 2013 . 14 2528 - 2533 . DOI: 10.1016/j.orgel.2013.06.028 http://doi.org/10.1016/j.orgel.2013.06.028 .

Yousef, H.; Lindeberg, M.; Hjort, K . Ion track enabled multiple wire microvia interconnects in printed circuit boards . Nucl. Instrum. Meth. B , 2008 . 266 1659 - 1665 . DOI: 10.1016/j.nimb.2007.11.014 http://doi.org/10.1016/j.nimb.2007.11.014 .

Park, J.; Lee, J.; Park, S.; Shin, K.; Lee, D . Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via -hole printing, and electroless plating . Int. J. Adv. Manuf. Tech. , 2015 . 82 1921 - 1931 . .

Kwon, Y.; Kim, Y.; Lee, Y.; Kwon, S.; Lim, M.; Song, Y.; Choa, Y.; Yeo, W . Ultrahigh conductivity and superior interfacial adhesion of a nanostructured, photonic-sintered copper membrane for printed flexible hybrid electronics . ACS. Appl. Mater. Inter. , 2018 . 10 44071 - 44079 . DOI: 10.1021/acsami.8b17164 http://doi.org/10.1021/acsami.8b17164 .

Cai, J.; Lv, C.; Watanabe, A . Laser direct writing and selective metallization of metallic circuits for integrated wireless devices . ACS. Appl. Mater. Inter. , 2018 . 10 915 - 924 . DOI: 10.1021/acsami.7b16558 http://doi.org/10.1021/acsami.7b16558 .

Liu, Y.; Lee, M . Laser direct synthesis and patterning of silver nano/microstructures on a polymer substrate . ACS. Appl. Mater. Inter. , 2014 . 6 14576 - 14582 . DOI: 10.1021/am503897r http://doi.org/10.1021/am503897r .

Fernandes, D.; Majidi, C.; Tavakoli, M. Digitally printed stretchable electronics: a review. J. Mater. Chem. C, 2019, 7 , 14035-14068.

Eshkeiti, A.; Reddy, A. S. G.; Emamian, S.; Narakathu, B. B.; Joyce, M.; Joyce, M.; Fleming, P. D.; Bazuin, B. J.; Atashbar, M. Z . Screen printing of multilayered hybrid printed circuit boards on different substrates . IEEE. T. Comp. Pack. Man. , 2015 . 5 415 - 421 . .

Kubo, Y.; Tanaka, H.; Saito, Y.; Mizoguchi, A . Fabrication of a bilayer structure of Cu and polyimide to realize circuit microminiaturization and high interfacial adhesion in flexible electronic devices . ACS. Appl. Mater. Inter. , 2018 . 10 44589 - 44602 . DOI: 10.1021/acsami.8b15835 http://doi.org/10.1021/acsami.8b15835 .

Wu, Z.; Parvez, K.; Winter, A.; Vieker, H.; Liu, X.; Han, S.; Turchanin, A.; Feng, X.; Mullen, K . Layer-by-layer assembled heteroatom-doped graphene films with ultrahigh volumetric capacitance and rate capability for micro-supercapacitors . Adv. Mater. , 2014 . 26 4552 - 4558 . DOI: 10.1002/adma.201401228 http://doi.org/10.1002/adma.201401228 .

Lai, Y.; Sil, M. C.; Chen, C . Surface composite engineering of polyimide to create amine functionalities for autocatalytic metallization . Appl. Surf. Sci. , 2021 . 541 148500 DOI: 10.1016/j.apsusc.2020.148500 http://doi.org/10.1016/j.apsusc.2020.148500 .

Kim, H. J.; Park, Y. J.; Choi, J.; Han, H. S.; Hong, Y. T . Surface modification of polyimide film by coupling reaction for copper metallization . J. Ind. Eng. Chem. , 2009 . 15 23 - 30 . DOI: 10.1016/j.jiec.2008.08.016 http://doi.org/10.1016/j.jiec.2008.08.016 .

Yu, Y.; Xiao, X.; Zhang, Y.; Li, K.; Yan, C.; Wei, X.; Chen, L.; Zhen, H.; Zhou, H.; Zhang, S.; Zheng, Z . Photoreactive and metal-Platable copolymer inks for high-throughput, room-temperature printing of flexible metal electrodes for thin-film electronics . Adv. Mater. , 2016 . 28 4926 - 4934 . DOI: 10.1002/adma.201505119 http://doi.org/10.1002/adma.201505119 .

Chang, Y.; Yang, C.; Zheng, X.; Wang, D.; Yang, Z . Fabrication of copper patterns on flexible substrate by patterning-adsorption-plating process . ACS Appl. Mater. Interfaces , 2014 . 6 768 - 772 . DOI: 10.1021/am405539r http://doi.org/10.1021/am405539r .

Khan, Y.; Thielens, A.; Muin, S.; Ting, J.; Baumbauer, C.; Arias, A. C . A new frontier of printed electronics: flexible hybrid electronics . Adv. Mater. , 2020 . 32 1905279 DOI: 10.1002/adma.201905279 http://doi.org/10.1002/adma.201905279 .

Zhou, H.; Qin, W.; Yu, Q.; Cheng, H.; Yu, X.; Wu, H . Transfer printing and its applications in flexible electronic devices . Nanomaterials , 2019 . 9 283 DOI: 10.3390/nano9020283 http://doi.org/10.3390/nano9020283 .

Li, D.; Lai, W.; Zhang, Y.; Huang, W . Printable transparent conductive films for flexible electronics . Adv. Mater. , 2018 . 30 1704738 DOI: 10.1002/adma.201704738 http://doi.org/10.1002/adma.201704738 .

Voigt, M. M.; Mackenzie, R. C. I.; King, S. P.; Yau, C. P.; Atienzar, P.; Dane, J.; Keivanidis, P. E.; Zadrazil, I.; Bradley, D. D.C.; Nelson, J . Gravure printing inverted organic solar cells: The influence of ink properties on film quality and device performance . Sol. Energ. Mat. Sol. C , 2012 . 105 77 - 85 . DOI: 10.1016/j.solmat.2012.04.025 http://doi.org/10.1016/j.solmat.2012.04.025 .

Tseng, C.; Chang, C.; Sung, Y.; Chen, Y.; Ger, M . A novel method to produce Pd nanoparticle ink for ink-jet printing technology . Colloid. Surface. A , 2009 . 339 206 - 210 . DOI: 10.1016/j.colsurfa.2009.02.026 http://doi.org/10.1016/j.colsurfa.2009.02.026 .

Jang, D.; Kim, D.; Lee, B.; Kim, S.; Kang, M.; Min, D.; Moon, J . Nanosized glass frit as an adhesion promoter for ink-jet printed conductive patterns on glass substrates annealed at high temperatures . Adv. Funct. Mater. , 2008 . 18 2862 - 2868 . DOI: 10.1002/adfm.200800238 http://doi.org/10.1002/adfm.200800238 .

Chiang, P.; Whang, W.; Wu, S.; Chuang, K . Effects of titania content and plasma treatment on the interfacial adhesion mechanism of nano titania-hybridized polyimide and copper system . Polymer , 2004 . 45 4465 - 4472 . DOI: 10.1016/j.polymer.2004.04.024 http://doi.org/10.1016/j.polymer.2004.04.024 .

Liu, J.; Li, M.; Yang, Y.; Xu, L.; Lin, J.; Hong, W.; Chen, X . Metal conductive surface patterning on photoactive polyimide . Adv. Funct. Mater. , 2017 . 27 1701674 DOI: 10.1002/adfm.201701674 http://doi.org/10.1002/adfm.201701674 .

Marques-Hueso, J.; Jones, T. D. A.; Watson, D. E.; Ryspayeva, A.; Esfahani, M. N.; Shuttleworth, M. P.; Harris, R. A.; Kay, R. W.; Desmulliez, M. P. Y . A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide . Adv. Funct. Mater. , 2017 . 28 1704451 .

Chen, J.; Zhang, J.; Wang, Y.; Guo, Y.; Feng, Z . A particle-free silver precursor ink useful for inkjet printing to fabricate highly conductive patterns . J. Mater. Chem. C , 2016 . 4 10494 - 10499 . DOI: 10.1039/C6TC03719D http://doi.org/10.1039/C6TC03719D .

Chen, J.; Lin, G.; Wang, Y.; Sowade, E.; Baumann, R. R.; Feng, Z . Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating . Appl. Surf. Sci. , 2017 . 396 202 - 207 . DOI: 10.1016/j.apsusc.2016.09.152 http://doi.org/10.1016/j.apsusc.2016.09.152 .

Ratautas, K.; Andrulevičius, M.; Jagminienė, A.; Stankevičienė, I.; Norkus, E.; Račiukaitis, G . Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating-process and activation mechanism . Appl. Surf. Sci. , 2019 . 470 405 - 410 . DOI: 10.1016/j.apsusc.2018.11.091 http://doi.org/10.1016/j.apsusc.2018.11.091 .

Gill, T.; Zhao, J.; Berenschot, E. J . W.; Tas, N.; Zheng, X. Conformal electroless nickel plating on silicon wafers, convex and concave pyramids, and ultralong nanowires . ACS. Appl. Mater. Interfaces , 2018 . 10 22834 - 22840 . DOI: 10.1021/acsami.8b06002 http://doi.org/10.1021/acsami.8b06002 .

Charbonnier, M.; Romand, M.; Goepfert, Y.; Léonard, D.; Bessueille, F.; Bouadi, M . Palladium (+2) reduction: A key step for the electroless Ni metallization of insulating substrates by a tin-free process . Thin Solid Films , 2006 . 515 1623 - 1633 . DOI: 10.1016/j.tsf.2006.05.032 http://doi.org/10.1016/j.tsf.2006.05.032 .

Chang, L.; Zhang, X.; Ding, Y.; Liu, H.; Liu, M.; Jiang, L . Ionogel/Copper grid composites for high-performance, ultra-stable flexible transparent electrodes . ACS. Appl. Mater. Interfaces , 2018 . 10 29010 - 29018 . DOI: 10.1021/acsami.8b09023 http://doi.org/10.1021/acsami.8b09023 .

Zacharatos, F.; Makrygianni, M.; Geremia, R.; Biver, E.; Karnakis, D.; Leyder, S.; Puerto, D.; Delaporte, P.; Zergioti, I . Laser Direct Write micro-fabrication of large area electronics on flexible substrates . Appl. Surf. Sci. , 2016 . 374 117 - 123 . DOI: 10.1016/j.apsusc.2015.10.066 http://doi.org/10.1016/j.apsusc.2015.10.066 .

Zope, K . R.; Cormier, D.; Williams, S. Reactive silver oxalate ink composition with enhanced curing conditions for flexible substrates . ACS. Appl. Mater. Interfaces , 2018 . 10 3830 - 3837 . DOI: 10.1021/acsami.7b19161 http://doi.org/10.1021/acsami.7b19161 .

Knapp, C. E.; Chemin, J.; Douglas, S. P.; Ondo, D. A.; Guillot, J.; Choquet, P.; Boscher, N. D . Room-temperature plasma-assisted inkjet printing of highly conductive silver on paper . Adv. Mater. Tech. , 2018 . 3 1700326 DOI: 10.1002/admt.201700326 http://doi.org/10.1002/admt.201700326 .

Zhang, N.; Huang, C.; Wan, S.; Kang, L.; Hu, M.; Zhang, Y.; Wu, X.; Zhang, J . A novel flexible silver heater fabricated by a solution-based polyimide metalization and inkjet-printed carbon masking technique . ACS. Appl. Electron. Mater. , 2019 . 1 928 - 935 . DOI: 10.1021/acsaelm.9b00109 http://doi.org/10.1021/acsaelm.9b00109 .

Yang, T.; Yu, Y.; Zhu, L.; Wu, X.; Wang, X.; Zhang, J . Fabrication of silver interdigitated electrodes on polyimide films via surface modification and ion-exchange technique and its flexible humidity sensor application . Sens. Actuat. B , 2015 . 208 327 - 333 . DOI: 10.1016/j.snb.2014.11.043 http://doi.org/10.1016/j.snb.2014.11.043 .

Gout, S.; Coulm, J.; Léonard, D.; Bessueille, F . Silver localization on polyimide using microcontact printing and electroless metallization . Appl. Surf. Sci. , 2014 . 307 716 - 723 . DOI: 10.1016/j.apsusc.2014.04.108 http://doi.org/10.1016/j.apsusc.2014.04.108 .

Li, Y.; Lu, Q.; Qian, X.; Zhu, Z.; Yin, J . Preparation of surface bound silver nanoparticles on polyimide by surface modification method and its application on electroless metal deposition . Appl. Surf. Sci. , 2004 . 233 299 - 306 . DOI: 10.1016/j.apsusc.2004.03.235 http://doi.org/10.1016/j.apsusc.2004.03.235 .

Farrer, R. A.; LaFratta, C. N.; Li, L.; Praino, J.; Naughton, M. J.; Saleh, B. E. A.; Teich, M. C.; Fourkas, J. T . Selective functionalization of 3-D polymer microstructures . J. Am. Chem. Soc. , 2006 . 128 1796 - 1797 . DOI: 10.1021/ja0583620 http://doi.org/10.1021/ja0583620 .

Kwon, H.; Cha, J.; Gong, M . Preparation of silvered polyimide film from silver carbamate complex using CO 2 , amine, and alcohol . J. CO 2 Util. , 2018 . 27 547 - 554 . DOI: 10.1016/j.jcou.2018.09.005 http://doi.org/10.1016/j.jcou.2018.09.005 .

浏览量

258

Downloads

CSCD

文章被引用时，请邮件提醒。

Submit

工具集

关联资源

Molecularly Engineered Polyimide Films with Switchable Cavitation for Bidirectional Passive Thermal Regulation

High-performance Polyimide Cuff Tube with Tunable Mechanics and Long-term Biocompatibility for Microvascular Anastomosis

Machine-learning-assisted Materials Genome Approach for Designing High-performance Thermosetting Polyimides

Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites

Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF3 Incorporation