Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared <italic style="font-style: italic">via</italic> Microlayer Coextrusion

Qi Luo; Hong-Ting Pu; Zhi-Hua Zhang; Xiong Zhang; Cheng-Long Yu

doi:10.1007/s10118-021-2524-0

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Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion

ARTICLE | Updated：2020-11-30

- Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion
- Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion
- Chinese Journal of Polymer Science 2021年39卷第5期页码：566-572
- Affiliations：
  
  a.Department of Polymeric Materials, School of Materials Science & Engineering, Tongji University, Shanghai 201804, China
  b.Key Laboratory of Advanced Civil Engineering Materials (Ministry of Education), Tongji University, Shanghai 201804, China
  c.School of Physics Science and Engineering & Shanghai Key Laboratory of Special Artificial Microstructure Materials and Technology, Tongji University, Shanghai 200092, China
- Author bio：
  
  puhongting@tongji.edu.cn
- Funds：
  
  The work was financially supported by National Key Research and Development Program of China (No. 2017YFA0204600) and Major Program for Fundamental Research of Science & Technology Commission of Shanghai Municipality (No. 14JC1492700).
- DOI：10.1007/s10118-021-2524-0
  中图分类号：
- 收稿：2020-09-07，
  
  修回：2020-10-12，
  
  录用：2020-11-2，
  
  网络首发：2020-11-30，
  
  纸质出版：2021-01-01
- Accepted：
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Luo, Q.; Pu, H. T.; Zhang, Z. H.; Zhang, X.; Yu, C. L. Foam/film alternating multilayer structure with high toughness and low thermal conductivity prepared , via, microlayer coextrusion. Chinese J. Polym. Sci. 2021, 39, 566–572

Qi Luo, Hong-Ting Pu, Zhi-Hua Zhang, et al. Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion[J]. Chinese Journal of Polymer Science, 2021, 39(5): 566-572. DOI: 10.1007/s10118-021-2524-0.
Luo, Q.; Pu, H. T.; Zhang, Z. H.; Zhang, X.; Yu, C. L. Foam/film alternating multilayer structure with high toughness and low thermal conductivity prepared , via, microlayer coextrusion. Chinese J. Polym. Sci. 2021, 39, 566–572 DOI： 10.1007/s10118-021-2524-0.

Qi Luo, Hong-Ting Pu, Zhi-Hua Zhang, et al. Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion[J]. Chinese Journal of Polymer Science, 2021, 39(5): 566-572. DOI: 10.1007/s10118-021-2524-0. DOI：

摘要

Abstract

Multilayer membranes prepared

via

microlayer coextrusion have attracted wide attention due to their unique properties and broad applications. In present study

the foam/film alternating multilayer sheets based on ethylene-vinyl acetate copolymer (EVA) and high-density polyethylene are successfully prepared

via

microlayer coextrusion. The cells in the sheets are single-cell-array along the foamed EVA layers with uniform cell size. In addition

the effects of layer number and foam relative thickness on morphology

mechanical properties

damping and heat insulation properties are investigated. The cell size decreases significantly with increasing layer number due to the enhanced confine effects. The tensile strength

elongation at break

and heat insulation also increase significantly. However

the mechanical damping properties change little in the observed frequency. Meanwhile

with higher relative thickness of EVA foam

the sheets have lower tensile strength and lower thermal conductivity

while the damping properties are enhanced in a specific frequency scope. The elongation at break of the optimized sample comes to 800% and the thermal conductivity decreases to 61 mW·m

−1

·K

−1

which shows high toughness and low thermal conductivity

indicating a possible method for preparing materials with high toughness and heat-insulating properties.

关键词

Keywords

references

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Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion

DOI：10.1007/s10118-021-2524-0

摘要

Abstract

关键词

Keywords

references