Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE

Lan Bai; Lei Zhai; Min-Hui He; Chang-Ou Wang; Song Mo; Lin Fan

doi:10.1007/s10118-020-2366-1

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Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE

ARTICLE | Updated：2019-12-13

- Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE
- Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE
- Chinese Journal of Polymer Science 2020年38卷第7期页码：748-758
- Affiliations：
  
  a.Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  b.School of Chemistry and Chemical Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
- Author bio：
  
  zhailei@iccas.ac.cn (L.Z.)
  fanlin@iccas.ac.cn (L.F.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 51803221).
- DOI：10.1007/s10118-020-2366-1
  中图分类号：
- 收稿：2019-09-12，
  
  修回：2019-10-8，
  
  录用：2019-10-29，
  
  网络首发：2019-12-13，
  
  纸质出版：2020-07
- Accepted：
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Bai, L.; Zhai, L.; He, M. H.; Wang, C. O.; Mo, S.; Fan, L. Thermal expansion behavior of poly(amide-imide) films with ultrahigh tensile strength and ultralow CTE. Chinese J. Polym. Sci. 2020, 38, 748–758

Lan Bai, Lei Zhai, Min-Hui He, et al. Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE[J]. Chinese Journal of Polymer Science, 2020, 38(7): 748-758.
Bai, L.; Zhai, L.; He, M. H.; Wang, C. O.; Mo, S.; Fan, L. Thermal expansion behavior of poly(amide-imide) films with ultrahigh tensile strength and ultralow CTE. Chinese J. Polym. Sci. 2020, 38, 748–758 DOI： 10.1007/s10118-020-2366-1.

Lan Bai, Lei Zhai, Min-Hui He, et al. Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE[J]. Chinese Journal of Polymer Science, 2020, 38(7): 748-758. DOI： 10.1007/s10118-020-2366-1.

摘要

Abstract

A series of novel poly(amide-imide) (PAI) films with different amide contents were prepared from pyromellitic dianhydride and four amide-containing diamines. These PAI films exhibited excellent mechanical and thermal properties with tensile strength of 203.7−297.4 MPa and

above 407 °C. The rigid backbone structures combined with strong intermolecular interactions provided PAI films with ultralow in-plane CTE values from −4.17 ppm/°C to −0.39 ppm/°C in the temperature range of 30−300 °C. The correlation between thermal expansion behavior and aggregation structures of PAI film was investigated. The results suggested that hydrogen bonding interactions could be maintained even at high temperature

thus resulting in good dimension reversibility of films in multiple heating-cooling cycles. It is demonstrated that dimensional stabilities of PAI films are determined by the rigidity

orientation

and packing of molecular chains. Heat-resistant PAI films with ultralow CTE can be developed as flexible substrates by regulating backbones and aggregation structures for optoelectronic application.

关键词

Keywords

references

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