PCFM Lab, GD HPPC Lab, Guangdong Engineering Technology Research Centre for High-performance Organic and Polymer Photoelectric Functional Films, State Key Laboratory of Optoelectronic Materials and Technologies, School of Chemistry, Sun Yat-sen University, Guangzhou 510275, China
ceszy@mail.sysu.edu.cn
收稿:2019-06-14,
修回:2019-7-27,
录用:2019-8-7,
网络首发:2019-10-22,
纸质出版:2020-03
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Qian, C.; Fan, Z. G.; Zheng, W. W.; Bei, R. X.; Zhu, T. W.; Liu, S. W.; Chi, Z. G.; Aldred, M. P.; Chen, X. D.; Zhang, Y.; Xu, J. R. A facile strategy for non-fluorinated intrinsic low-k and low-loss dielectric polymers: valid exploitation of secondary relaxation behaviors. Chinese J. Polym. Sci. 2020, 38, 213–219.
Chao Qian, Zhen-Guo Fan, Wei-Wen Zheng, et al. A Facile Strategy for Non-fluorinated Intrinsic Low-
Qian, C.; Fan, Z. G.; Zheng, W. W.; Bei, R. X.; Zhu, T. W.; Liu, S. W.; Chi, Z. G.; Aldred, M. P.; Chen, X. D.; Zhang, Y.; Xu, J. R. A facile strategy for non-fluorinated intrinsic low-k and low-loss dielectric polymers: valid exploitation of secondary relaxation behaviors. Chinese J. Polym. Sci. 2020, 38, 213–219. DOI: 10.1007/s10118-020-2339-4.
Chao Qian, Zhen-Guo Fan, Wei-Wen Zheng, et al. A Facile Strategy for Non-fluorinated Intrinsic Low-
High-performance low-
k
and low-loss circuit materials are urgently needed in the field of microelectronics due to the upcoming Fifth-Generation Mobile Communications Technology (5G Technology). Herein
a facile design strategy for non-fluorinated intrinsic low-
k
and low-loss polyimides is reported by fully considering the secondary relaxation behaviors of the polymer chains. A new amorphous non-fluorinated polymer (TmBPPA) with a
k
value of 2.23 and a loss tangent lower than 3.94 × 10
−3
at 10
4
Hz has been designed and synthesized
which to the best of our knowledge is the lowest value amongst the non-fluorinated and non-porous polymers reported in literature. Meanwhile
TmBPPA exhibits excellent overall properties
such as excellent thermostability
good mechanical properties
low moisture absorption
and high bonding strength. As high-performance flexible circuit materials
all these characteristics are highly expected to meet the present and future demands for high density
high speed
and high frequency electronic circuit used in 5G wireless networks.
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