A Soft Shape Memory Reversible Dry Adhesive

Jian-Te Dong; Wei-Ke Zou; Feng Chen; Qian Zhao

doi:10.1007/s10118-018-2119-6

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A Soft Shape Memory Reversible Dry Adhesive

ARTICLE | Updated：2021-02-18

- A Soft Shape Memory Reversible Dry Adhesive
- A Soft Shape Memory Reversible Dry Adhesive
- Chinese Journal of Polymer Science 2018年36卷第8期页码：953-959
- Affiliations：
  
  College of Chemical and Biological Engineering, Zhejiang University, Hangzhou 310027, China
- Author bio：
  
  qianzhao@zju.edu.cn
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (Nos. 21504077 and 51673169), Natural Science Foundation of Zhejiang Province for Distinguished Young Scholar (No. LR18E030001), and National Key Basic Research Program of China (No. 2015CB351903).
- DOI：10.1007/s10118-018-2119-6
  中图分类号：
- 收稿：2017-11-17，
  
  修回：2017-11-17，
  
  录用：2018-2-5，
  
  网络首发：2018-03-26，
  
  纸质出版：2018-08
- Accepted：
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Jian-Te Dong, Wei-Ke Zou, Feng Chen, 等. A Soft Shape Memory Reversible Dry Adhesive[J]. Chinese Journal of Polymer Science, 2018,36(8):953-959.

Jian-Te Dong, Wei-Ke Zou, Feng Chen, et al. A Soft Shape Memory Reversible Dry Adhesive[J]. Chinese Journal of Polymer Science, 2018, 36(8): 953-959.
Jian-Te Dong, Wei-Ke Zou, Feng Chen, 等. A Soft Shape Memory Reversible Dry Adhesive[J]. Chinese Journal of Polymer Science, 2018,36(8):953-959. DOI： 10.1007/s10118-018-2119-6.

Jian-Te Dong, Wei-Ke Zou, Feng Chen, et al. A Soft Shape Memory Reversible Dry Adhesive[J]. Chinese Journal of Polymer Science, 2018, 36(8): 953-959. DOI： 10.1007/s10118-018-2119-6.

摘要

Abstract

Transfer printing is a critical procedure for manufacturing stretchable electronics. During such a procedure

stamps are utilized to transfer micro devices from silicon wafers to stretchable polymeric substrates. In addition to conventional silicone rubber stamps

epoxy resin based shape memory stamps have been developed and the transfer yield is thus significantly promoted. However

elastic modulus of the epoxy stamps is too high at both glassy and rubbery states

which may break the brittle micro devices during the adhesion process under mechanical pressure. In this work

we synthesized a copolymer of butyl acrylate (BA) and polycaprolactone diacrylate (PCLDA) as a soft reversible dry adhesive enabling a shape memory capability based on crystalline transition of polycaprolactone (PCL) segments. For the sample containing 40 wt% BA and 60 wt% PCLDA

Young’s modulus was 8.3 and 0.9 MPa respectively below and above the thermal transition temperature

which was much lower than that of the epoxy adhesive. On the other hand

the soft material still provided nearly ideal shape memory fixity and recovery ratios. Subsequently

shape memory surface with cone-shaped microstructure was prepared

which enabled a heating induced strong-to-weak adhesion transition when the microstructure recovered from a pressed temporary morphology to the permanent cone-shaped morphology. Such a soft reversible dry adhesive may contribute to large-scale and automated transfer printing processing.

关键词

Keywords

references

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