a.Key Laboratory of Organosilicon Chemistry and Material Technology of Ministry of Education, Hangzhou Normal University, Hangzhou 311121, China
b.School of Chemistry and Chemical Engineering, Shandong University, Jinan 250100, China
Xiong-Fa Yang, E-mail yangxiongfa@163.com (X.F.Y)
Guo-Qiao Lai, E-mail laiguoqiao@aliyun.com (G.Q.L.)
收稿:2017-07-22,
录用:2017-8-30,
网络首发:2018-01-11,
纸质出版:2018-05-05
Scan QR Code
Xiong-Fa Yang, Jia Liu, Qiong Chen, 等. A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package[J]. Chinese Journal of Polymer Science, 2018,36(5):649-654.
Xiong-Fa Yang, Jia Liu, Qiong Chen, et al. A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package[J]. Chinese Journal of Polymer Science, 2018, 36(5): 649-654.
Xiong-Fa Yang, Jia Liu, Qiong Chen, 等. A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package[J]. Chinese Journal of Polymer Science, 2018,36(5):649-654. DOI: 10.1007/s10118-018-2028-8.
Xiong-Fa Yang, Jia Liu, Qiong Chen, et al. A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package[J]. Chinese Journal of Polymer Science, 2018, 36(5): 649-654. DOI: 10.1007/s10118-018-2028-8.
In this work
low-temperature vulcanized
transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly
transparent silane modified epoxy resins were produced through a controllable sol-gel method using
γ
-(2
3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently
various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature (40℃/2 h then 60℃/1 h) exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5℃ and adjustable hardness between 40-60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.
S. C. Yang , J. S. Kim , J. H. Jin , S. Y. Kwak , B. S. Bae . Thermal resistance of cycloaliphatic epoxy hybrimer based on sol-gel derived oligosiloxane for LED encapsulation . J. Appl. Polym. Sci. , 2010 . 117 ( 4 ): 2140 - 2145 . DOI: 10.1002/app.v117:4 http://doi.org/10.1002/app.v117:4 .
X. F. Yang , Q. Shao , L. L. Yang , X. B. Zhu , X. L. Hua , Q. L. Zheng , G. X. Song , G. Q. Lai . Preparation and performance of high refractive index silicone resin-type materials for the packaging of light-emitting diodes . J. Appl. Polym. Sci. , 2013 . 127 ( 127 ): 1717 - 1724 . http://onlinelibrary.wiley.com/doi/10.1002/app.37897/full http://onlinelibrary.wiley.com/doi/10.1002/app.37897/full , .
X. F. Yang , L. L. Yang , C. Cao , X. B. Zhu , X. L. Hua , Q. L. Zheng , G. X. Song , L. B. Wu , G. Q. Lai . Preparation of a silicone resin-type packaging material with high refractive index for light emitting diodes . Chem. J. Chin. Univ. , 2012 . 33 ( 5 ): 1078 - 1083 . http://en.cnki.com.cn/Article_en/CJFDTotal-GDXH201205040.htm http://en.cnki.com.cn/Article_en/CJFDTotal-GDXH201205040.htm , .
J. C. Huang , Y. P. Chu , M. Wei , R. D. Deanin . Comparison of epoxy resins for applications in light-emitting diodes . Adv. Polym. Technol. , 2004 . 23 ( 4 ): 298 - 306 . DOI: 10.1002/(ISSN)1098-2329 http://doi.org/10.1002/(ISSN)1098-2329 .
Z. Y. Bu , J. J. Hu , B. G. Li . Novel silicon-modified phenolic novolac resins:non-isothermal curing kinetics, and mechanical and thermal properties of their biofiber-reinforced composites . Thermochimica Acta , 2014 . 575 ( 1 ): 244 - 253 . https://www.sciencedirect.com/science/article/pii/S0040603113005583 https://www.sciencedirect.com/science/article/pii/S0040603113005583 , .
R. N. Kumar , L. Y. Keem , N. C. Mang , A. Abubakar . Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes . J. Appl. Polym. Sci. , 2006 . 100 ( 2 ): 1048 - 1056 . DOI: 10.1002/(ISSN)1097-4628 http://doi.org/10.1002/(ISSN)1097-4628 .
Y. H. Zhang , K. Y. Rhee , S. J. Park . Nanodiamond nanocluster-decorated graphene oxide/epoxy nanocomposites with enhanced mechanical behavior and thermal stability . Compos. Part B:Engineer. , 2017 . 114 111 - 120 . DOI: 10.1016/j.compositesb.2017.01.051 http://doi.org/10.1016/j.compositesb.2017.01.051 .
S. C. Yang , S. Y. Kwak , J. H. Jin , J. S. Kim , Y. W. Choi , K. W. Paik , B. S. Bae . Thermally resistant UV-curable epoxy-siloxane hybrid materials for light emitting diode (LED) encapsulation, J . Mater. Chem. , 2012 . 22 ( 18 ): 8874 - 8880 . DOI: 10.1039/c2jm16355a http://doi.org/10.1039/c2jm16355a .
J. S. Kim , S. C. Yang , S. Y. Kwak , Y. W. Choi , K. W. Paik , B. S. Bae . High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid . J. Mater. Chem. , 2012 . 22 ( 16 ): 7954 - 7960 . DOI: 10.1039/c2jm16907j http://doi.org/10.1039/c2jm16907j .
J. S. Kim , S. C. Yang , B. S. Bae . Thermally stable transparent sol-gel based siloxane hybrid material with high refractive index for light emitting diode (LED) encapsulation . Chem. Mater. , 2010 . 22 ( 11 ): 3549 - 3555 . DOI: 10.1021/cm100903b http://doi.org/10.1021/cm100903b .
S. K. Rath , J. G. Chavan , S. Sasane , A. Srivastava , M. Patri , A. B. Samui , B. C. Chakraborty , S. N. Sawant . Coatings of PDMS-modified epoxy via urethane linkage:Segmental correlation length, phase morphology, thermomechanical and surface behavior . Prog. Org. Coat. , 2009 . 65 ( 3 ): 366 - 374 . DOI: 10.1016/j.porgcoat.2009.02.007 http://doi.org/10.1016/j.porgcoat.2009.02.007 .
S. S. Huang , W. C. Zhou , F. Luo , D. M. Zhu . Mechanical and dielectric properties of short-carbon-fibers/epoxy-modified-organic-silicone-resin as heat resistant microwave absorbing coatings . J. Appl. Polym. Sci. , 2013 . 130 ( 130 ): 1392 - 1398 . .
S. Sobhani , A. Jannesari , S. Bastani . Effect of molecular weight and content of PDMS on morphology and properties of silicone-modified epoxy resin . J. Appl. Polym. Sci., , 2012 . 123 ( 1 ): 162 - 178 . DOI: 10.1002/app.34435 http://doi.org/10.1002/app.34435 .
S. Ahmad , S. M. Ashraf , E. Sharmin , A. Mohomad , M. Alam . Synthesis, formulation, and characterization of siloxane-modified epoxy-based anticorrosive paints . J. Appl. Polym. Sci. , 2006 . 100 ( 100 ): 4981 - 4991 . http://onlinelibrary.wiley.com/doi/10.1002/app.23295/full http://onlinelibrary.wiley.com/doi/10.1002/app.23295/full , .
S. A. Kumar , T. Balakrishnan , M. Alagar , Z. Denchev . Development and characterization of silicone/phosphorus modified epoxy materials and their application as anticorrosion and antifouling coatings . Prog. Org. Coat. , 2006 . 55 ( 3 ): 207 - 217 . DOI: 10.1016/j.porgcoat.2005.10.001 http://doi.org/10.1016/j.porgcoat.2005.10.001 .
S. Ahmad , A. P. Gupta , E. Sharmin , M. Alam , S.K. Pandey . Synthesis, characterization and development of high performance siloxane-modified epoxy paints . Prog. Org. Coat. , 2005 . 54 ( 3 ): 248 - 255 . DOI: 10.1016/j.porgcoat.2005.06.013 http://doi.org/10.1016/j.porgcoat.2005.06.013 .
Q. Wu , C. Zhang , R. Liang , B. Wang . Combustion and thermal properties of epoxy/phenyltrisilanol polyhedral oligomeric silsesquioxane nanocomposites . J. Therm. Anal. Calorim., , 2010 . 100 ( 3 ): 1009 - 1015 . DOI: 10.1007/s10973-009-0474-9 http://doi.org/10.1007/s10973-009-0474-9 .
D. H. Zhang , E. B. Liang , T. C. Li , S. F. Chen , J. H. Zhang , X. J. Cheng , J. L. Zhou , A. Q. Zhang . Environment-friendly synthesis and performance of a novel hyperbranched epoxy resin with a silicone skeleton. RSC Adv. , 2013 . 3 ( 9 ): 3095 - 3102 . http://dx.doi.org/10.1039/c2ra22969b http://dx.doi.org/10.1039/c2ra22969b , .
D. H. Zhang , E. B. Liang , T. C. Li , S. F. Chen , J. H. Zhang , X. J. Cheng , J. L. Zhou , A. Q. Zhang . The effect of molecular weight of hyperbranched epoxy resins with a silicone skeleton on performance . RSC Adv. , 2013 . 3 ( 24 ): 9522 - 9529 . DOI: 10.1039/c3ra00023k http://doi.org/10.1039/c3ra00023k .
ASTM E313-10: Standard practice for calculating yellowness and whiteness indices from instrumentally measured color coordinates. ASTM, Book Standards 2010, 6, pp6. DOI: 10.1520/E0313-10 http://dx.doi.org/10.1520/E0313-10
Y. H. Zhang , J. R. Choi , S. J. Park . Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics, Compos . Part A:Appl. Sci. Manufactur. , 2017 . 101 227 - 236 . DOI: 10.1016/j.compositesa.2017.06.019 http://doi.org/10.1016/j.compositesa.2017.06.019 .
J. Zhu , H. Peng , F. Rodriguez-Macias , J. L. Margrave , V. N. Khabashesku , A. Imam , K. Lozano , E. V. Barrera . Reinforcing epoxy polymer composites through covalent integration of functionalized nanotubes . Adv. Funct. Mater. , 2004 . 14 ( 7 ): 643 - 648 . DOI: 10.1002/(ISSN)1616-3028 http://doi.org/10.1002/(ISSN)1616-3028 .
Y. H. Zhang , S. J. Park . In situ modification of nanodiamonds by mercapto-terminated silane agent for enhancing the mechanical interfacial properties of nitrile butadiene rubber nanocomposites . Polym. Comps. , 2017 . DOI: 10.1002/pc.24367 http://doi.org/10.1002/pc.24367 .
0
浏览量
6
Downloads
0
CSCD
关联资源
相关文章
相关作者
相关机构
京公网安备11010802046900号