High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities

Wei Chen; Mian Ji; Shi-yong Yang

doi:10.1007/s10118-016-1813-5

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High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities

PAPERS | Updated：2021-05-12

- High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities
- High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities
- Chinese Journal of Polymer Science 2016年34卷第8期页码：933-948
- Affiliations：
  
  a. Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  b. University of Chinese Academy of Sciences, Beijing 100049, China
- Author bio：
  
  Shi-yong Yang (杨士勇), E-mail: shiyang@iccas.ac.cn
- Funds：
  
  This work was financially supported by the National Basic Research Program of China(2014CB643604)
- DOI：10.1007/s10118-016-1813-5
  中图分类号：
- 收稿：2016-02-07，
  
  修回：2016-4-3，
  
  录用：2016-4-6，
  
  纸质出版：2016-08
- Accepted：
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Wei Chen, Mian Ji, Shi-yong Yang. High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities[J]. Chinese Journal of Polymer Science, 2016,34(8):933-948.

Wei Chen, Mian Ji, Shi-yong Yang. High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities[J]. Chinese Journal of Polymer Science, 2016, 34(8): 933-948.
Wei Chen, Mian Ji, Shi-yong Yang. High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities[J]. Chinese Journal of Polymer Science, 2016,34(8):933-948. DOI： 10.1007/s10118-016-1813-5.

Wei Chen, Mian Ji, Shi-yong Yang. High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities[J]. Chinese Journal of Polymer Science, 2016, 34(8): 933-948. DOI： 10.1007/s10118-016-1813-5.

摘要

Abstract

To improve the processability and thermal stability of polyimide

a series of novel phenylethynyl-endcapped oligoimides (PEPA-oligoimides) with calculated molecular weights (

C) were successfully prepared from thermal imidization of 4

4'-(9-fluorenylidene) dianiline (BAFL) as fluorenyl diamine

4'-oxy-diphthalic anhydride (ODPA) as aromatic dianhydride and 4-phenylethynylphthalic anhydride (4-PEPA) acted as reactive end-capping reagent at elevated temperatures. Experiment results indicated that the oligoimides were the mixtures of PEPA-endcapped oligomers with different degrees of polymerization characterized by MALDI-TOF mass spectra. The influence of chemical structures on the melt processabilities of the oligoimides

the thermal

dielectric and mechanical properties of the thermoset resins was studied. The typical oligoimide resin owned minimum melt viscosity of 0.2 Pa·s at around 310℃ and wide melting processing window

suitable for resin transfer molding (RTM). Besides

its corresponding thermal-cured polyimide resin possessed glass transition temperature (

) as high as 514℃. The dielectric constants of polyimide resins decreased from 3.15 to 2.80 by reducing the

C. The mechanical properties of the polyimide neat resins were improved gradually with increasing

C. Finally

the carbon fiber/polyimide (C

/PI) composite laminates showed excellent mechanical strength retention rate at 350℃

might be long-term served at extremely high temperature in aerospace and aviation field.

关键词

Keywords

references

T.T. Serafini , P. Delvigs , G.R. Lightsey . J. Appl. Polym. Sci. , 1972 . 16 905 DOI: 10.1002/app.1972.070160409 http://doi.org/10.1002/app.1972.070160409 .

D. Wilson . Brit. Polym. J. , 1988 . 20 405 DOI: 10.1002/(ISSN)1934-256X http://doi.org/10.1002/(ISSN)1934-256X .

B. Jensen , A. Chang . High Perform. Polym. , 1998 . 10 175 DOI: 10.1088/0954-0083/10/2/002 http://doi.org/10.1088/0954-0083/10/2/002 .

P.M. Hergenrother . High Perform. Polym. , 2003 . 15 3 .

J. Smith , J.W. Connell , P. Hergenrother , J. Criss . J. Compos. Mater. , 2002 . 36 2255 DOI: 10.1177/0021998302036019293 http://doi.org/10.1177/0021998302036019293 .

P.M. Hergenrother , J.W. Connell , J. Smith . Polymer , 2000 . 41 5073 DOI: 10.1016/S0032-3861(99)00569-8 http://doi.org/10.1016/S0032-3861(99)00569-8 .

P. Yu , Y. Wang , J.R. Yu , J. Zhu , Z.M. Hu . Chinese J. Polym. Sci. , 2016 . 34 ( 1 ): 122 DOI: 10.1007/s10118-016-1733-4 http://doi.org/10.1007/s10118-016-1733-4 .

M. Yang , D.M. Wang , N.W. Sun , C.H. Chen , X.G. Zhao . High Perform. Polym. , 2015 . 27 449 DOI: 10.1177/0954008314555521 http://doi.org/10.1177/0954008314555521 .

L. Sun , W. Wang , L.B. Xu , G.F. Chen , X.Z. Fang . High Perform. Polym. , 2015 . DOI: 10.1177/0954008315610394 http://doi.org/10.1177/0954008315610394 .

X. Rao , H. Zhou , G. Dang , C. Chen , Z. Wu . Polymer , 2006 . 47 6091 DOI: 10.1016/j.polymer.2006.06.037 http://doi.org/10.1016/j.polymer.2006.06.037 .

R. Yokota , S. Yamamoto , S. Yano , T. Sawaguchi , M. Hasegawa , H. Yamaguchi , H. Ozawa , R. Sato . High Perform. Polym. , 2001 . 13 .

J.W. Connell , Jr J.G. Smith , P. Hergenrother . J. Macromol. Sci. Polym. R. , 2000 . 40 207 DOI: 10.1081/MC-100100585 http://doi.org/10.1081/MC-100100585 .

D.H. Wang , J.B. Baek , S.F. Nishino , J.C. Spain , L.S. Tan . Polymer , 2006 . 47 1197 DOI: 10.1016/j.polymer.2005.12.061 http://doi.org/10.1016/j.polymer.2005.12.061 .

Jr J. Smith , J. Connell , P. Hergenrother . J. Compos. Mater. , 2000 . 34 614 DOI: 10.1177/002199830003400705 http://doi.org/10.1177/002199830003400705 .

R.G. Bryant , B.J. Jensen , P.M. Hergenrother . J. Appl. Polym. Sci. , 1996 . 59 1249 DOI: 10.1002/(ISSN)1097-4628 http://doi.org/10.1002/(ISSN)1097-4628 .

P. Hergenrother , J. Smith . Polymer , 1994 . 35 4857 DOI: 10.1016/0032-3861(94)90744-7 http://doi.org/10.1016/0032-3861(94)90744-7 .

Y.T. Chern , J.Y. Tsai , J.J. Wang . J.Polym. Sci.Part A:Polym. Chem. , 2009 . 47 2443 DOI: 10.1002/pola.v47:9 http://doi.org/10.1002/pola.v47:9 .

T. Ogasawara , T. Ishikawa , R. Yokota , H. Ozawa , M. Taguchi , R. Sato , Y. Shigenari , K. Miyagawa . Adv. Compos. Mater. , 2002 . 11 277 DOI: 10.1163/156855102762506317 http://doi.org/10.1163/156855102762506317 .

T. Ogasawara , Y. Ishida , R. Yokota , T. Watanabe , T. Aoi , J. Goto . Compos. Part A-Appl. S. , 2007 . 38 1296 DOI: 10.1016/j.compositesa.2006.11.007 http://doi.org/10.1016/j.compositesa.2006.11.007 .

T. Sasaki , R. Yokota . High Perform. Polym. , 2006 . 18 199 DOI: 10.1177/0954008306058269 http://doi.org/10.1177/0954008306058269 .

Y. Ishida , T. Ogasawara , R. Yokota . High Perform. Polym. , 2006 . 18 727 DOI: 10.1177/0954008306068250 http://doi.org/10.1177/0954008306068250 .

Qian, Y. and Huang, W., 2010, U.S. Pat., 5, 387, 725

T. Kuroki , A. Shibuya , M. Toriida , S. Tamai . J.Polym. Sci.Part A:Polym. Chem. , 2004 . 42 2395 DOI: 10.1002/(ISSN)1099-0518 http://doi.org/10.1002/(ISSN)1099-0518 .

H. Zuo , J. Chen , A. Hu , L. Fan , S. Yang . Eur. Polym. J. , 2007 . 43 3892 DOI: 10.1016/j.eurpolymj.2007.06.009 http://doi.org/10.1016/j.eurpolymj.2007.06.009 .

M. Miyauchi , Y. Ishida , T. Ogasawara , R. Yolota . Polym. J. , 2013 . 45 594 DOI: 10.1038/pj.2012.160 http://doi.org/10.1038/pj.2012.160 .

C.H. Zhang , G.D. Su , H. Chen , Y. Sun , H.R. Song , L.L. Tong . J. Appl. Polym. Sci. , 2015 . 132 41303 .

D. Cho , L.T. Drzal . J. Appl. Polym. Sci. , 2000 . 76 190 DOI: 10.1002/(ISSN)1097-4628 http://doi.org/10.1002/(ISSN)1097-4628 .

C. n. Su , M. Ji , L. Fan , S.Y. Yang . High Perform. Polym. , 2011 . 23 352 DOI: 10.1177/0954008311410997 http://doi.org/10.1177/0954008311410997 .

J.C. Coburn , P.D. Soper , B.C. Auman . Macromolecules , 1995 . 28 3253 DOI: 10.1021/ma00113a030 http://doi.org/10.1021/ma00113a030 .

X.J. Zhao , J.G. Liu , J.M. Rui , L. Fan , S.Y. Yang . J. Appl. Polym. Sci. , 2007 . 103 1442 DOI: 10.1002/(ISSN)1097-4628 http://doi.org/10.1002/(ISSN)1097-4628 .

K. Goyo , M. Kakuta , Y. Inoue , M. Matsubara . J. Photopolym. Sci. Tec. , 2000 . 13 313 DOI: 10.2494/photopolymer.13.313 http://doi.org/10.2494/photopolymer.13.313 .

K. Goyo , Y. Inoue , M. Matsubara . J. Photopolym. Sci. Tec. , 2001 . 14 33 DOI: 10.2494/photopolymer.14.33 http://doi.org/10.2494/photopolymer.14.33 .

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