SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN

KUANG Wenfeng; CAI Xingxian; JIANG Luxia

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SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN

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- SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN
- SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN
- 高分子科学（英文版） 1997年15卷第3期页码：231-235
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- 纸质出版：1997-09-20
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KUANG Wenfeng, CAI Xingxian, JIANG Luxia. SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN[J]. 高分子科学（英文版）, 1997,15(3):231-235.

KUANG Wenfeng, CAI Xingxian, JIANG Luxia. SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN[J]. 1997, 15(3): 231-235.
KUANG Wenfeng, CAI Xingxian, JIANG Luxia. SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN[J]. 高分子科学（英文版）, 1997,15(3):231-235. DOI：

KUANG Wenfeng, CAI Xingxian, JIANG Luxia. SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN[J]. 1997, 15(3): 231-235. DOI：

摘要

A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized andthe copolymerization was studied by using N-phenylmaleimide

bisphenol A and diphenyl-silandiol as model compounds. The copolymer could be well cured around 200℃

andthe cured resins had good thermal stability In the range of 170-210℃

a higher curingtemperature was favorable to obtain more thermal stable resin by reducing the content ofdiphenylsilandiol cyclo-homopolymer in resin which would spoil its thermal stability.

Abstract

A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized andthe copolymerization was studied by using N-phenylmaleimide

bisphenol A and diphenyl-silandiol as model compounds. The copolymer could be well cured around 200℃

andthe cured resins had good thermal stability In the range of 170-210℃

a higher curingtemperature was favorable to obtain more thermal stable resin by reducing the content ofdiphenylsilandiol cyclo-homopolymer in resin which would spoil its thermal stability.

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