THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY*
Papers|Updated:2021-06-21
|
THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY*
THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY*
高分子科学(英文版)1992年10卷第1期 页码:81-88
Affiliations:
1. State Key Laboratory of Engineering Plastics, Institute of Chemistry, Academia Sinica,Beijing,100080
2. Institute of Chemistry
3. Academia Sinica
4. Beijing 100080
Author bio:
Funds:
DOI:
中图分类号:
纸质出版:1992-03-20
Accepted:
Scan QR Code
[1]王维,吴选征,漆宗能.THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY[J].Chinese Journal of Polymer Science,1992,{4}(01):81-88.
WANG Wei, WU Xuanzheng, QI Zongneng. THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY*[J]. 1992, 10(1): 81-88.
[1]王维,吴选征,漆宗能.THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY[J].Chinese Journal of Polymer Science,1992,{4}(01):81-88.DOI:
WANG Wei, WU Xuanzheng, QI Zongneng. THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY*[J]. 1992, 10(1): 81-88.DOI:
THE MECHANISM OF CURE REACTION OF 4,4'-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4'-DIAMINODIPHENYL METHANE EPOXY*
4’-diaminodiphenyl methane (TGDDM) epoxy resin with 4
4’-diaminodiphenyl methane (DDM) has been studied by using DSC. Instead of one exothermic peak
two exothermic peaks
indicative of a complex reaction mechanism
are shown in the DSC curve of TGDDM-DDM mixtures in nonisothermal cure experiments when the content of DDM is lower than stoichiometric ratio. The result of the kinetic analysis of the cure reaction shows that the activation energy of the lower temperature exotherm peak is about 56 kJ/mol and that of the higher temperature exotherm peak is about 136 kJ/mol. The lower temperature cure reaction peak can be attributed to the primary amine-epoxide and secondary amine-epoxide reactions
and the higher temperature cure reaction peak can be attributed to the epoxide-hydroxy reaction under catalysis of tertiary amine in the TGDDM epoxy resin. Because the network density of the cured epoxy resin is determined by these two reactions
the content of DDM has little effect on the glass transition temperature of cured epoxy resin.
Abstract
The cure reaction of tetraglycidyl 4
4’-diaminodiphenyl methane (TGDDM) epoxy resin with 4
4’-diaminodiphenyl methane (DDM) has been studied by using DSC. Instead of one exothermic peak
two exothermic peaks
indicative of a complex reaction mechanism
are shown in the DSC curve of TGDDM-DDM mixtures in nonisothermal cure experiments when the content of DDM is lower than stoichiometric ratio. The result of the kinetic analysis of the cure reaction shows that the activation energy of the lower temperature exotherm peak is about 56 kJ/mol and that of the higher temperature exotherm peak is about 136 kJ/mol. The lower temperature cure reaction peak can be attributed to the primary amine-epoxide and secondary amine-epoxide reactions
and the higher temperature cure reaction peak can be attributed to the epoxide-hydroxy reaction under catalysis of tertiary amine in the TGDDM epoxy resin. Because the network density of the cured epoxy resin is determined by these two reactions
the content of DDM has little effect on the glass transition temperature of cured epoxy resin.
关键词
Keywords
references
The trial reading is over, you can activate your VIP account to continue reading.
Alternating Poly(ether-alt-ester)s with High Glass Transition Temperature Enabled by Rotationally Constrained Biaryl Units
Circularly Polarized Luminescence Based on Helical Polymers: Structure-Property Relationships and Regulation Mechanisms
Multiple-Responsive Chiral Hydrogels from Helical Dendronized Poly(phenylacetylene)s
On-demand Peelable UV-curable Adhesives with Superior Bonding Strength: Rational Molecular Engineering of Cohesion-adhesion Synergy
Upgrading Commercially Available Polyethylene to High-value Materials with Strong Mechanical Performance and Hydrophilicity by Blending with Ethylene/meta-Methoxystyrene Copolymers