Research on Improving the Thermal Conductivity of Epoxy Resin with Flexible Assisted Rigid Groups

Hong-Yu Zhu; Yan-Ji Zhu; Di Bao; Lu-Chao Pei; Fei Xu; Zhe Wang; Huai-Yuan Wang

doi:10.1007/s10118-024-3163-z

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Research on Improving the Thermal Conductivity of Epoxy Resin with Flexible Assisted Rigid Groups

RESEARCH ARTICLE | Updated：2024-11-04

- Research on Improving the Thermal Conductivity of Epoxy Resin with Flexible Assisted Rigid Groups
- Chinese Journal of Polymer Science Vol. 42, Issue 11, Pages: 1845-1854(2024)
- Affiliations：
  
  a.School of Materials Science and Engineering, Tianjin University, Tianjin 300050, China
  b.Collaborative Innovation Centre of Chemical Science and Engineering (Tianjin), Tianjin University, Tianjin 300072, China
  c.Tianjin Key Laboratory of Chemical Process Safety and Equipment Technology, Tianjin University, Tianjin 300072, China
  d.School of Chemical Engineering and Technology and State Key Laboratory for Chemical Engineering, Tianjin University, Tianjin 300350, China
- Author bio：
  
  yanji.zhu@tju.edu.cn
- Funds：
- DOI：10.1007/s10118-024-3163-z
  CLC：
- Published：30 November 2024，
  
  Published Online：20 August 2024，
  
  Received：04 April 2024，
  
  Revised：10 May 2024，
  
  Accepted：14 May 2024
- Accepted：
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Zhu, H. Y.; Zhu, Y. J.; Bao, D.; Pei, L. C.; Xu, F.; Wang, Z.; Wang, H. Y. Research on improving the thermal conductivity of epoxy resin with flexible assisted rigid groups. Chinese J. Polym. Sci. 2024, 42, 1845–1854

Hong-Yu Zhu, Yan-Ji Zhu, Di Bao, et al. Research on Improving the Thermal Conductivity of Epoxy Resin with Flexible Assisted Rigid Groups. [J]. Chinese Journal of Polymer Science, 2024,42(11):1845-1854.
Zhu, H. Y.; Zhu, Y. J.; Bao, D.; Pei, L. C.; Xu, F.; Wang, Z.; Wang, H. Y. Research on improving the thermal conductivity of epoxy resin with flexible assisted rigid groups. Chinese J. Polym. Sci. 2024, 42, 1845–1854 DOI： 10.1007/s10118-024-3163-z.

Hong-Yu Zhu, Yan-Ji Zhu, Di Bao, et al. Research on Improving the Thermal Conductivity of Epoxy Resin with Flexible Assisted Rigid Groups. [J]. Chinese Journal of Polymer Science, 2024,42(11):1845-1854. DOI： 10.1007/s10118-024-3163-z.

摘要

The thermal conductivity of the material is improved by introducing rigid mesocrystalline motifs into the epoxy resin through prepared small molecule liquid crystals (SMLCs) assisted by flexible chains of appropriate length.

Abstract

Epoxy resins are cross-linked polymeric materials with typically low thermal conductivity. Currently

the introduction of rigid groups into epoxy resins is the main method to improve their intrinsic thermal conductivity. The researchers explored the relationship between the flexible chains of epoxy monomers and the thermal conductivity of the modified epoxy resins (MEP). The effect of flexible chain length on the introduction of rigid groups into the cross-linked structure of epoxy is worth investigating

which is of great significance for the improvement of thermal conductivity of polymers and related theories. We prepared a small molecule liquid crystal (SMLC) containing a long flexible chain

via

a simple synthesis reaction

and introduced rigid mesocrystalline units into the epoxy resin

via

a curin

g reaction. During high-temperature curing

the introduced mesocrystalline units underwent orientational stacking and were immobilized within the polymer. XRD and TGA tests showed that the ordering within the modified epoxy resin was increased

which improved the thermal conductivity of the epoxy resin. Crucially

during the above process

the flexible chains of SMLC provide space for the biphenyl groups to align and therefore affect the thermal conductivity of the MEP. Specifically

the MEP-VI cured with SMLC-VI containing six carbon atoms in the flexible chain has the highest thermal conductivity of 0.40 W·m

−1

·K

−1

which is 125% of the thermal conductivity of SMLC-IV of 0.32 W·m

−1

·K

−1

111% of the thermal conductivity of SMLC-VIII of 0.36 W·m

−1

·K

−1

and 182% of the thermal conductivity of pure epoxy of 0.22 W·m

−1

·K

−1

. The introduction of appropriate length flexible chains for SMLC promotes the stacking of rigid groups within the resin while reducing the occurrence of chain folding. This study will provide new ideas for the enhancement of thermal conductivity of cross-linked polymeric materials.

关键词

Keywords

Epoxy ResinPolymerThermal conductivityRigid groupFlexible chain

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