Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides <italic style="font-style: italic">via</italic> ―CF<sub>3</sub> Incorporation

Xiao-Ying Xing; Xin-Er Liu; Zun-Chu Liu; Chu-Ying Li; Xue-Yi Yu; Ye Zhang; Xin-Zheng Huang; Ruo-Peng Liu; Si-Wei Liu; Yi Zhang

doi:10.1007/s10118-026-3716-4

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Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation

RESEARCH ARTICLE | Updated：2026-08-07

- Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation
- Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation
- Chinese Journal of Polymer Science 2026年44卷页码：1-15
- Affiliations：
  
  a.PCFM Lab, GD HPPC Lab, Guangdong Engineering Technology Research Centre for High-performance Organic and Polymer Photoelectric Functional Films, GBRCE for Functional Molecular Engineering, State Key Laboratory of Optoelectronic Materials and Technologies, School of Chemistry, IGCME, Sun Yat-sen University, Guangzhou 510275, China
  b.Shenzhen Kuang-Chi Cutting-edge Technology Co., Ltd, Shenzhen 518057, China
- Author bio：
  
  ruopeng.liu@kuang-chi.com (R.P.L)
  ceszy@mail.sysu.edu.cn (Y.Z.)
- Funds：
  
  This work was financially supported by the Shenzhen Municipal Bureau of Science and Technology Innovation (No. KJZD20240904170759001), Guangdong Provincial Department of Science and Technology (No. 2024B0101120001), the National Natural Science Foundation of China (Nos. U20A20255 and 52203286), and National Key R&D Program of China (No. 2022YFB3806600).;The authors declare no interest conflict.Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-026-3716-4.The data supporting the findings of this study are available from the corresponding author upon reasonable request.
- DOI：10.1007/s10118-026-3716-4
  中图分类号：
- 收稿：2026-04-16，
  
  录用：2026-05-16，
  
  网络首发：2026-08-07，
  
  纸质出版：2026-09-05
- Accepted：
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Xing, X. Y.; Liu, X. E.; Liu, Z. C.; Li, C. Y.; Yu, X. Y.; Zhang, Y.; Huang, X. Z.; Liu, R. P.; Liu, S. W.; Zhang, Y. Enhancing processability of phenylethynyl-terminated imide oligomers and properties of cured polyimides via ―CF₃ incorporation. Chinese J. Polym. Sci. https://doi.org/10.1007/s10118-026-3716-4

Xiao-Ying Xing, Xin-Er Liu, Zun-Chu Liu, et al. Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation[J/OL]. Chinese Journal of Polymer Science, 2026, 441-15. DOI: 10.1007/s10118-026-3716-4.
Xing, X. Y.; Liu, X. E.; Liu, Z. C.; Li, C. Y.; Yu, X. Y.; Zhang, Y.; Huang, X. Z.; Liu, R. P.; Liu, S. W.; Zhang, Y. Enhancing processability of phenylethynyl-terminated imide oligomers and properties of cured polyimides via ―CF₃ incorporation. Chinese J. Polym. Sci. https://doi.org/10.1007/s10118-026-3716-4 DOI：

Xiao-Ying Xing, Xin-Er Liu, Zun-Chu Liu, et al. Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation[J/OL]. Chinese Journal of Polymer Science, 2026, 441-15. DOI: 10.1007/s10118-026-3716-4. DOI：

摘要

Abstract

Advanced aerospace technologies demand polymer-based wave-transparent materials with low dielectric constant (

)

low dissipation factor (

)

and high heat resistance for hypersonic vehicles. Thermosetting polyimides (PIs) from phenylethynyl-terminated imide (PETI) oligomers are promising candidates due to their excellent thermal stability; however

their application is limited by high

and

at high frequencies and processing difficulties. Here

a series of PETI oligomers were designed and synthesized by polycondensation of 9

9-bis(3

4-dicarboxyphenyl)fluorene dianhydride containing a Cardo structure

and six diamine monomers

respectively. The diamines were divided into three pairs by backbone flexibility

with each pair comprising a non-fluorinated diamine and its trifluoromethyl (―CF

) substituted analog. The effects of c

hain segment flexibility and ―CF

substitution on the processability of the oligomers and the properties of the cured PIs were systematically investigated. Results show that oligomers with ―CF

groups exhibit enhanced solubility and improved viscosity stability at 270 °C compared to their non-fluorinated counterparts. Moreover

the corresponding cured resins show lower

and

values while maintaining good thermal stability and mechanical properties. Notably

the BPAF-FA system exhibits favorable properties: an oligomer solubility of 40 wt% in NMP

and a minimum melt viscosity of 5.61 Pa·s;

=2.953

=0.0098 (at 50% RH)

=403 °C. Mechanistic analysis indicates that these improvements result from the synergistic effects of the intrinsic characteristics of ―CF

groups (steric hindrance

electron-withdrawing effect

low polarizability

and hydrophobicity) and their role in influencing chain flexibility

symmetry

and molecular packing. These findings provide valuable guidance for the design of high-temperature-resistant

low-dielectric wave-transparent composite materials.

关键词

Keywords

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Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF3 Incorporation

Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF3 Incorporation

DOI：10.1007/s10118-026-3716-4

摘要

Abstract

关键词

Keywords

references

Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation

Enhancing Processability of Phenylethynyl-terminated Imide Oligomers and Properties of Cured Polyimides via ―CF₃ Incorporation