Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure

Hui Zhang; Hui-Shan Hu; Zhi-Yu Lu; Ming-Wei Liu; Hua Ge; Hui-Bo Yuan; Jian-Jun Song; Wan-Yi Tan; Ting-Ting Cui; Yong-Gang Min

doi:10.1007/s10118-025-3338-2

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Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure

RESEARCH ARTICLE | Updated：2025-07-15

- Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure
- Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure
- 高分子科学（英文） 2025年43卷第7期页码：1222-1230
- Affiliations：
  
  a.School of Materials and Energy, Guangdong University of Technology (GDUT), Guangzhou 510640, China
  b.Guangzhou Liangyue Materials Technology Co., Ltd., Guangzhou 510663, China
- Author bio：
  
  tanwanyi@gdut.edu.cn (W.Y.T.)
  cuitt@gdut.edu.cn (T.T.C.)
  ygmin@gdut.edu.cn (Y.G.M.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (Nos. U20A20340 and 52001068), Key-Area Research and Development Program of Guangdong Province (No. 2020B010182001), Dongguan Key Research & Development Program (No. 20231200300192), Science and Technology Projects in Guangzhou (No. 2025A04J3832), Foshan Introducing Innovative and Entrepreneurial Teams (No. 1920001000108), and Guangzhou Hongmian Project (No. HMJH-2020-0012) .;Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-025-3338-2.
- DOI：10.1007/s10118-025-3338-2
  中图分类号：
- 收稿：2025-01-18，
  
  修回：2025-03-04，
  
  录用：2025-03-12，
  
  网络首发：2025-05-14，
  
  纸质出版：2025-07-01
- Accepted：
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Zhang, H.; Hu, H. S.; Lu, Z. Y.; Liu, M. W.; Ge, H.; Yuan, H. B.; Song, J. J.; Tan, W. Y.; Cui, T. T.; Min, Y. G. Intrinsically low dielectric constant and low dielectric loss polyimides enabled by rigid-soft structure. Chinese J. Polym. Sci. 2025, 43, 1222–1230

Hui Zhang, Hui-Shan Hu, Zhi-Yu Lu, et al. Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure[J]. Chinese Journal of Polymer Science, 2025, 43(7): 1222-1230.
Zhang, H.; Hu, H. S.; Lu, Z. Y.; Liu, M. W.; Ge, H.; Yuan, H. B.; Song, J. J.; Tan, W. Y.; Cui, T. T.; Min, Y. G. Intrinsically low dielectric constant and low dielectric loss polyimides enabled by rigid-soft structure. Chinese J. Polym. Sci. 2025, 43, 1222–1230 DOI： 10.1007/s10118-025-3338-2.

Hui Zhang, Hui-Shan Hu, Zhi-Yu Lu, et al. Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure[J]. Chinese Journal of Polymer Science, 2025, 43(7): 1222-1230. DOI： 10.1007/s10118-025-3338-2.

摘要

Develop an effective strategy to achieve low

at high frequency by endowing MPIs with rigid-soft structures based on a naphthalene-alkyl-based diamine.

Abstract

Modified polyimides (MPIs) possess excellent thermal stability

chemical stability

and mechanical properties

and are considered to be a kind of dielectric material for high-frequency communication. Enhancing the rigidity of the polymer chains and intermolecular interactions can ensure low

at high frequency

which is attributed to the effective restriction of dipole orientations. However

it is difficult to achieve tight chain packing in an overly rigid polymer chain

whereas an overly flexible polymer chain might be insufficient to restrain small-scale molecular motions below

. To balance the trade-off between the rigidity of the polymer chains and tight chain packing

MPI was developed with a rigid-soft structure based on a naphthalene-alkyl-based diamine. On the one hand

incorporating the soft unit can enhance the movability of polymer chains to achieve dense chain packing for polyimides (PIs). On the other hand

the p

resence of rigid aromatic units can enhance intermolecular interactions and further restrict the motion of polar imide groups below

. As a result

the resultant MPI can prevent small-scale molecular motion below

. In contrast to the reference PI-TFMB-6FDA

is significantly reduced from 2.72/0.0075 to 2.73/0.005 at a high frequency of 10 GHz. Furthermore

the rigid-soft structure endows PIs with good thermoplasticity owing to the good chain flexibility above

. In addition

PIs based on rigid-soft structures can preserve favorable thermal stability.

关键词

Keywords

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