Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System

Yu-Cheng Zi; Gao-Jie Wu; Dong-Xu Pei; Shu Guo; Sheng-Li Qi; Guo-Feng Tian; De-Zhen Wu

doi:10.1007/s10118-023-2941-3

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Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System

RESEARCH ARTICLE | Updated：2023-05-26

- Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System
- Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System
- 高分子科学（英文版） 2023年41卷第6期页码：956-961
- Affiliations：
  
  a.Key Laboratory of Carbon Fiber and Functional Polymers (Beijing University of Chemical Technology), Ministry of Education, Beijing 100029, China
  b.Institute of Analysis and Testing, Beijing Academy of Science and Technology (Beijing Center For Physical & Chemical Analysis), Beijing 100089, China
- Author bio：
  
  tiangf@mail.buct.edu.cn
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (No. 51773007) and the Fundamental Research Funds for the Central Universities (No. XK1802-2).
- DOI：10.1007/s10118-023-2941-3
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Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System[J]. 高分子科学（英文版）, 2023,41(6):956-961.

Yu-Cheng Zi, Gao-Jie Wu, Dong-Xu Pei, et al. Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System[J]. Chinese Journal of Polymer Science, 2023,41(6):956-961.
Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System[J]. 高分子科学（英文版）, 2023,41(6):956-961. DOI： 10.1007/s10118-023-2941-3.

Yu-Cheng Zi, Gao-Jie Wu, Dong-Xu Pei, et al. Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System[J]. Chinese Journal of Polymer Science, 2023,41(6):956-961. DOI： 10.1007/s10118-023-2941-3.

摘要

Blending the flexible system BPADA/PDA and the rigid system BPDA/PDA at prepolymer stage. The flexible system ensured the melt processing performance, while the rigid system inhibited the movement of molecular chains and reduce the free volume fraction, thereby reducing the CTE value.

Abstract

A series of thermoplastic polyimide resins with a low coefficient of thermal expansion (CTE) were prepared by blending a rigid resin system 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA)/,p,-phenylenediamine (PDA) with a flexible resin system 4,4'-[isopropylidenebis(,p,-phenyleneoxy)]diphthalic anhydride (BPADA)/PDA. The effects of the blending ratio on the macromolecular coil size, free volume, and CTE of the mixed system were studied. The mixing is carried out in the prepolymer poly(amide acid) (PAA) stage, which makes the two systems more compatible and is conducive to the formation of a semi-interpenetrating network structure between the rigid molecular chains and flexible molecular chains. The flexible structure of the BPADA/PDA system is used to ensure the melt processing performance. The rigid characteristics of the BPDA/PDA system can inhibit the movement of molecular chains and reduce the free volume fraction, thereby reducing the CTE value. When the rigid system content reaches 30%, the CTE can be reduced to 38 ppm/K. This method provides a new approach for studying low CTE thermoplastic polyimide resins.

关键词

Keywords

Coefficient of thermal expansion (CTE)Thermoplastic polyimideMelt processing propertyBlending

references

Imaizumi,S.;Ohtsuki,Y.;Yasuda,T.Printablepolymeractuatorsfromionicliquid,solublepolyimide,andubiquitouscarbonmaterials.ACS Appl. Mater. Interfaces2013,5,6307−6315..

Kim,I.C.;Park,K.W.;TakT.M.Synthesisandcharacterizationofsolublepolyimidesanditsultrafiltrationmembraneperformances.J. Appl. Polym. Sci.1999,73,907−918..

Mittal,K.L.Polyimides:synthesis,characterization,andapplications.Polym. Compos.1982,3,245..

Makino,D.ApplicationofpolyimideresintosemiconductordevicesinJapan.IEEE. Electr. Ins. Mag.1988,4,15−23..

Shukla,P.;Saxena,P.Polymernanocompositesinsensorapplications:areviewonpresenttrendsandfuturescope.Chinese J. Polym. Sci.2021,39,665−691..

Mustafa,C.;Emre,A.Characterizationofcarbonfiber-reinforcedthermoplasticandthermosettingpolyimidematrixcompositesmanufacturedbyusingvarioussynthesizedPIprecursorresins.Compos. Part B-Eng.2022,231,109559..

Xu,J.;Huang,X.;Davim,J.P.;Ji,M.;Chen,M.OnthemachiningbehaviorofcarbonfiberreinforcedpolyimideandPEEKthermoplasticcomposites.Polym. Compos.2020,41,3649−3663..

Ye,W.L.;Wu,W.Z.;Hu,X.;Lin,G.G.3Dprintingofcarbonnanotubesreinforcedthermoplasticpolyimidecompositeswithcontrollablemechanicalandelectricalperformance.Compos. Sci. Technol.2019,182,107671..

Byberg,K.I.;Gebisa,A.W.;Lemu,H.G.MechanicalpropertiesofULTEM9085materialprocessedbyfuseddepositionmodeling.Polym. Test.2018,72,335−347..

Hu,J.;Wang,J.;Qi,S.Thermoplasticandsolubleco-polyimideresinsfabricatedviatheincorporationof2,3,3’,4’-biphenyltetracarboxylicdianhydride.High. Perform. Polym.2019,31,1272−1279..

Yi,L.;Li,C.;Huang,W.Solublepolyimidesfrom4,4’-diaminodiphenyletherwithoneortwotert-butylpedantgroups.Polymer2015,80,67−75..

Kim,S.D.;Lee,S.;Heo,J.Solublepolyimideswithtrifluoromethylpendentgroups.Polymer2013,54,5648−5654..

Sensui,N.;Ishii,J.;Takata,A.Ultra-lowCTEandimprovedtoughnessofPMDA/PDApolyimide-basedmolecularcompositescontainingasymmetricBPDA-typepolyimides.High. Perform. Polym.2009,21,709−728..

Hasegawa,M.;Watanabe,Y.;Tsukuda,S.Solution-processablecolorlesspolyimideswithultralowcoefficientsofthermalexpansionforoptoelectronicapplications.Polym. Int.2016,65,1063−1073..

Yi,J.;Liu,C.;Tian,Y.;Wang,K.;Liu,X.;Luo,L.Improvingdimensionalstabilityathightemperatureandtoughnessofpolyimidefilmsviaadjustableentanglementdensity.Polymer2021,218,123488..

Gao,G.;Mao,D.;Fan,B.;Guan,C.Effectofwetexpansionbehavioronpolyimidemembranediffractivelens.Coatings2019,9,559..

Yin,J.;Mao,D.;Fan,B.Copolyamide-imidemembranewithlowCTEandCMEforpotentialspaceopticalapplications.Polymers2021,13,1001..

Jung,Y.;Yang,Y.;Kim,S.Structuralandcompositionaleffectsonthermalexpansionbehaviorinpolyimidesubstratesofvaryingthicknesses.Eur. Polym. J.2013,49,3642−3650..

Tan,Y.;Zhang,Y.;Jiang,G.Preparationandpropertiesofinherentlyblackpolyimidefilmswithextremelylowcoefficientsofthermalexpansionandpotentialapplicationsforblackflexiblecoppercladlaminates.Polymers2020,12,576..

Yu,X.H.;Liu,J.N.;Wu,D.Y.ColorlessPIstructuredesignandevaluationforachievinglowCTEtarget.Mater. Today Commun.2019,21,100562..

Yang,Z.;Guo,H.;Kang,C.Synthesisandcharacterizationofamide-bridgedcolorlesspolyimidefilmswithlowCTEandhighopticalperformanceforflexibleOLEDdisplays.Polym. Chem.2021,12,5364−5376..

Mushtaq,N.;Wang,Q.;Chen,G.Synthesisofpolyamide-imideswithdifferentmonomersequenceandeffectontransparencyandthermalproperties.Polymer2020,190,122218..

Bai,L.;Zhai,L.;He,M.H.Thermalexpansionbehaviorofpoly(amide-imide)filmswithultrahightensilestrengthandultralowCTE.Chinese J. Polym. Sci.2020,38,748−758..

Tsai,M.H.;Huang,Y.C.;Tseng,I.H.Thermalandmechanicalpropertiesofpolyimide/nano-silicahybridfilms.Thin Solid. Films.2011,519,5238−5242..

Luo,J.;Wu,Y.;Sun,Y.;Wang,G.;Liu,Y.;Zhao,X.;Ding,G.PreparationandcharacterizationofhighthermalconductivityandlowCTEpolyimidecompositereinforcedwithdiamondnanoparticles/SiCwhiskersfor3DICinterposerRDLdielectric.Appl. Sci.2019,9,1962..

Zhou,H.;Lei,H.;Wang,J.Breakingthemutualrestraintbetweenlowpermittivityandlowthermalexpansioninpolyimidefilmsviaabranchedcrosslinkstructure.Polymer2019,162,116−120..

Han,S.;Li,Y.;Hao,F.Ultra-lowdielectricconstantpolyimides:Combinedeffortsoffluorinationandmicro-branchedcrosslinkstructure.Eur. Polym. J.2021,143,110206..

Zhi,X.;Jiang,G.;Zhang,Y.Preparationandpropertiesofcolorlessandtransparentsemi-alicyclicpolyimidefilmswithenhancedhigh-temperaturedimensionalstabilityviaincorporationofalkyl-substitutedbenzanilideunits.J. Appl. Polym. Sci.2022,139,51544..

Peng,W.F.;Lei,H.Y.;Zhang,X.X.Fluorinesubstitutioneffectonthematerialpropertiesintransparentaromaticpolyimides.Chinese J. Polym. Sci.2022,40,781−788..

Lao,H.;Mushtaq,N.;Chen,G.Synthesisandpropertiesoftransparentrandomandmulti-blockpolyamide-imidefilmswithhighmodulusandlowCTE.Eur. Polym. J.2021,153,110512..

Li,X.;Lei,H.;Guo,J.;Wang,J.CompositiondesignandpropertiesinvestigationofBPDA/PDA/TFDBco-polyimidefilmswithlowdielectricpermittivity.J. Appl. Polym. Sci.2019,136,47989..

Hao,F.Y.;Wang,J.H.;Qi,S.L.Structuresandpropertiesofpolyimidewithdifferentpre-imidizationdegrees.Chinese J. Polym. Sci.2020,38,840−846..

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