Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management

Bo-Wen Wang; Heng Zhang; Qing-Xia He; Hui-Tao Yu; Meng-Meng Qin; Wei Feng

doi:10.1007/s10118-024-3159-8

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Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management

RESEARCH ARTICLE | Updated：2024-06-26

- Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management
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- Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management
- 高分子科学（英文版） 2024年42卷第7期页码：1002-1014
- Affiliations：
  
  a.Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China
  b.International Engineering Institute, Tianjin University, Tianjin 300350, China
- Author bio：
  
  qmm@tju.edu.cn (M.M.Q.)
  weifeng@tju.edu.cn (W.F.)
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (Nos. 52130303, 52327802 and 52173078) and National Key R&D Program of China (No. 2022YFB3805702).;Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-024-3159-8.
- DOI：10.1007/s10118-024-3159-8
  中图分类号：
- 纸质出版日期：2024-07-01，
  
  网络出版日期：2024-05-23，
  
  收稿日期：2024-04-09，
  
  修回日期：2024-05-05，
  
  录用日期：2024-05-08
- Accepted：
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Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management[J]. 高分子科学（英文版）, 2024,42(7):1002-1014.

BO-WEN WANG, HENG ZHANG, QING-XIA HE, et al. Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management. [J]. Chinese journal of polymer science, 2024, 42(7): 1002-1014.
Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management[J]. 高分子科学（英文版）, 2024,42(7):1002-1014. DOI： 10.1007/s10118-024-3159-8.

BO-WEN WANG, HENG ZHANG, QING-XIA HE, et al. Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management. [J]. Chinese journal of polymer science, 2024, 42(7): 1002-1014. DOI： 10.1007/s10118-024-3159-8.

摘要

Graphene paper with a special corrugated structure was prepared by a simple hot-pressing process. The interface interaction between the graphene paper framework and polymer matrix was enhanced. This corrugated structure composite material possesses tunability

allowing for customized design and fabrication according to specific requirements.

Abstract

With

the rapid development of high-power-density electronic devices

interface thermal resistance has become a critical barrier for effective heat management in high-performance electronic products. Therefore

there is an urgent demand for advanced thermal interface materials (TIMs) with high cross-plane thermal conductivity and excellent compressibility to withstand increasingly complex operating conditions. To achieve this aim

a promising strategy involves vertically arranging highly thermoconductive graphene on polymers. However

with the currently available methods

achieving a balance between low interfacial thermal resistance

bidirectional high thermal conductivity

and large-scale production is challenging. Herein

we prepared a graphene framework with continuous filler structures in in-plane and cross-plane directions by bonding corrugated graphene to planar graphene paper. The interface interaction between the graphene paper framework and polymer matrix was enhanced

via

surface functionalization to reduce the interface thermal resistance. The resulting three-dimensional thermal framework endows the polymer composite material with a cross-plane thermal conductivity of 14.4 W·m

−1

·K

−1

and in-plane thermal conductivity of 130 W·m

−1

·K

−1

when the thermal filler loading is 10.1 wt%

with a thermal conductivity enhancement per 1 wt% filler loading of 831%

outperforming various graphene structures as fillers. Given its high thermal conductivity

low contact thermal resistance

and low compressive modulus

the developed highly thermoconductive composite material demonstrates superior performance in TIM testing compared with TFLEX-700

an advanced commercial TIM

effectively solving the interfacial heat transfer issues in electronic systems. This novel filler structure framework also provides a solution for achieving a balance between efficient thermal management and ease of processing.

关键词

Keywords

Graphene paperVertically aligned structureCross-plane thermal conductivityLow compressive modulusThermal interface material

references

Zhang, Q.; Lv, Y.; Wang, Y.; Yu, S.; Li, C.; Ma, R.; Chen, Y. Temperature-dependent dual-mode thermal management device with net zero energy for year-round energy saving.Nat. Commun.2022,13, 4874..

Zhu, Z.; Li, C.; Songfeng, E.; Xie, L.; Geng, R.; Lin, C.-T.; Li, L.; Yao, Y. Enhanced thermal conductivity of polyurethane compositesviaengineering small/large sizes interconnected boron nitride nanosheets.Compos. Sci. Technol.2019,170, 93−100..

Peng, L.; Yu, H.; Chen, C.; He, Q.; Zhang, H.; Zhao, F.; Qin, M.; Feng, Y.; Feng, W. Tailoring dense, orientation-tunable, and interleavedly structured carbon-based heat dissipation plates.Adv. Sci. 2023 , 2205962..

Yue, J.; Feng, Y.; Qin, M.; Feng, W. Carbon-based materials with combined functions of thermal management and electromagnetic protection: preparation, mechanisms, properties, and applications.Nano Res.2024,17, 883−903..

Yu, C.; Zhang, J.; Li, Z.; Tian, W.; Wang, L.; Luo, J.; Li, Q.; Fan, X.; Yao, Y. Enhanced through-plane thermal conductivity of boron nitride/epoxy composites.Compos. Part Appl. Sci. Manuf.2017,98, 25−31..

Xu, X.; Chen, J.; Zhou, J.; Li, B. Thermal conductivity of polymers and their nanocomposites.Adv. Mater.2018,30, 1705544..

Yu, C.; Gong, W.; Tian, W.; Zhang, Q.; Xu, Y.; Lin, Z.; Hu, M.; Fan, X.; Yao, Y. Hot-pressing induced alignment of boron nitride in polyurethane for composite films with thermal conductivity over 50 W m−1 K−1.Compos. Sci. Technol.2018,160, 199−207..

Balandin, A. A.; Ghosh, S.; Bao, W.; Calizo, I.; Teweldebrhan, D.; Miao, F.; Lau, C. N. Superior thermal conductivity of single-layer graphene.Nano Lett.2008,8, 902−907..

Zhang, J.; Shi, G.; Jiang, C.; Ju, S.; Jiang, D. 3D bridged carbon nanoring/graphene hybrid paper as a high-performance lateral heat spreader.Small 2015 ,11, 6197–6204..

Kong, Q.; Liu, Z.; Gao, J.; Chen, C.; Zhang, Q.; Zhou, G.; Tao, Z.; Zhang, X.; Wang, M.; Li, F.; Cai, R. Hierarchical graphene-carbon fiber composite paper as a flexible lateral heat spreader.Adv. Funct. Mater.2014,24, 4222−4228..

Ying, J.; Tan, X.; Lv, L.; Wang, X.; Gao, J.; Yan, Q.; Ma, H.; Nishimura, K.; Li, H.; Yu, J.; Liu, T.-H.; Xiang, R.; Sun, R.; Jiang, N.; Wong, C.; Maruyama, S.; Lin, C. T.; Dai, W. Tailoring highly ordered graphene framework in epoxy for high-performance polymer-based heat dissipation plates.ACS Nano2021,15, 12922−12934..

Song, S. H.; Park, K. H.; Kim, B. H.; Choi, Y. W.; Jun, G. H.; Lee, D. J.; Kong, B. S.; Paik, K. W.; Jeon, S. Enhanced thermal conductivity of epoxy-graphene composites by using non-oxidized graphene flakes with non-covalent functionalization.Adv. Mater.2013,25, 732−737..

Shtein, M.; Nadiv, R.; Buzaglo, M.; Kahil, K.; Regev, O. Thermally conductive graphene-polymer composites: size, percolation, and synergy effects.Chem. Mater.2015,27, 2100−2106..

Wang, F.; Zeng, X.; Yao, Y.; Sun, R.; Xu, J.; Wong, C. P. Silver nanoparticle-deposited boron nitride nanosheets as fillers for polymeric composites with high thermal conductivity.Sci. Rep.2016,6, 19394..

Ma, J.; Shang, T.; Ren, L.; Yao, Y.; Zhang, T.; Xie, J.; Zhang, B.; Zeng, X.; Sun, R.; Xu, J. B.; Wong, C. P. Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material.Chem. Eng. J.2020,380, 122550..

Hou, H.; Dai, W.; Yan, Q.; Lv, L.; Alam, F. E.; Yang, M.; Yao, Y.; Zeng, X.; Xu, J.-B.; Yu, J.; Jiang, N.; Lin, C. T. Graphene size-dependent modulation of graphene frameworks contributing to the superior thermal conductivity of epoxy composites.J. Mater. Chem. A2018,6, 12091−12097..

Yang, J.; Zhang, E.; Li, X.; Zhang, Y.; Qu, J.; Yu, Z. Z. Cellulose/graphene aerogel supported phase change composites with high thermal conductivity and good shape stability for thermal energy storage.Carbon2016,98, 50−57..

Qin, M.; Xu, Y.; Cao, R.; Feng, W.; Chen, L. Efficiently controlling the 3D thermal conductivity of a polymer nanocompositeviaa hyperelastic double-continuous network of graphene and sponge.Adv. Funct. Mater.2018,28, 1805053..

Ji, H.; Sellan, D. P.; Pettes, M. T.; Kong, X.; Ji, J.; Shi, L.; Ruoff, R. S. Enhanced thermal conductivity of phase change materials with ultrathin-graphite foams for thermal energy storage.Energy Environ. Sci.2014,7, 1185−1192..

Yang, J.; Li, X.; Han, S.; Yang, R.; Min, P.; Yu, Z. Z. High-quality graphene aerogels for thermally conductive phase change composites with excellent shape stability.J. Mater. Chem. A2018,6, 5880−5886..

He, Q.; Qin, M.; Zhang, H.; Yue, J.; Peng, L.; Liu, G.; Feng, Y.; Feng, W. Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management.Mater. Horiz.2023,2, 531−544..

Gao, W.; Wang, M.; Bai, H. A review of multifunctional nacre-mimetic materials based on bidirectional freeze casting.J. Mech. Behav. Biomed. Mater.2020,109, 103820..

Min, P.; Liu, J.; Li, X.; An, F.; Liu, P.; Shen, Y.; Koratkar, N.; Yu, Z. Thermally conductive phase change composites featuring anisotropic graphene aerogels for real-time and fast-charging solar-thermal energy conversion.Adv. Funct. Mater.2018,28, 1805365..

Li, J.; Zhang, Y.; Liang, T.; Bai, X.; Pang, Y.; Zeng, X.; Hu, Q.; Tu, W.; Ye, Z.; Du, G.; Sun, R.; Zeng, X. Thermal interface materials with both high through-plane thermal conductivity and excellent elastic compliance.Chem. Mater.2021,33, 8926−8937..

Dai, W.; Ma, T.; Yan, Q.; Gao, J.; Tan, X.; Lv, L.; Hou, H.; Wei, Q.; Yu, J.; Wu, J.; Yao, Y.; Du, S.; Sun, R.; Jiang, N.; Wang, Y.; Kong, J.; Wong, C.; Maruyama, S.; Lin, C. T. Metal-level thermally conductive yet soft graphene thermal interface materials.ACS Nano2019,13, 11561−11571..

Tang, L.; Ruan, K.; Liu, X.; Tang, Y.; Zhang, Y.; Gu, J. Flexible and robust functionalized boron nitride/poly(p-phenylene benzobisoxazole) nanocomposite paper with high thermal conductivity and outstanding electrical insulation.Nano-Micro Lett.2024,16, 38..

Zhang, Y.; Choi, J. R.; Park, S. J. Enhancing the heat and load transfer efficiency by optimizing the interface of hexagonal boron nitride/elastomer nanocomposites for thermal management applications.Polymer2018,143, 1−9..

Chu, K.; Wang, J.; Liu, Y.; Geng, Z. Graphene defect engineering for optimizing the interface and mechanical properties of graphene/copper composites.Carbon2018,140, 112−123..

Hu, P.; Madsen, J.; Skov, A. L. One reaction to make highly stretchable or extremely soft silicone elastomers from easily available materials.Nat. Commun.2022,13,370..

Peng, L.; Xu, Z.; Liu, Z.; Guo, Y.; Li, P.; Gao, C. Ultrahigh thermal conductive yet superflexible graphene films.Adv. Mater.2017,29, 1700589..

Gao, X.; Zheng, L.; Luo, F.; Qian, J.; Wang, J.; Yan, M.; Wang, W.; Wu, Q.; Tang, J.; Cao, Y.; Tan, C.; Tang, J.; Zhu, M.; Wang, Y.; Li, Y.; Sun, L.; Gao, G.; Yin, J.; Lin, L.; Liu, Z.; Qin, S.; Peng, H. Integrated wafer-scale ultra-flat graphene by gradient surface energy modulation.Nat. Commun.2022,13, 5410..

Srinivasan, N. R.; Shankar, P. A.; Bandyopadhyaya, R. Plasma treated activated carbon impregnated with silver nanoparticles for improved antibacterial effect in water disinfection.Carbon2013,57, 1−10..

Kang, S.; He, M.; Chen, M.; Wang, J.; Zheng, L.; Chang, X.; Duan, H.; Sun, D.; Dong, M.; Cui, L. Ultrafast plasma immersion strategy for rational modulation of oxygen-containing and amino groups in graphitic carbon nitride.Carbon2020,159, 51−64..

Han, X.; Gao, J.; Chen, T.; Zhao, Y. Interfacial interaction and steric repulsion in polymer-assisted liquid exfoliation to produce high-quality graphene.Chem. Pap.2020,74, 757−765..

Lin, S. B.; Durfee, L. D.; Ekeland, R. A.; McVie, J.; Schalau, G. K. Recent advances in silicone pressure-sensitive adhesives.J. Adhes. Sci. Technol.2007,21, 605−623..

Witte, P. T.; Boland, S.; Kirby, F.; van Maanen, R.; Bleeker, B. F.; de Winter, D. A. M.; Post, J. A.; Geus, J. W.; Berben, P. H. NanoSelect Pd catalysts: what causes the high selectivity of these supported colloidal catalysts in alkyne semi-hydrogenation.ChemCatChem.2013,5, 582−587..

Wang, B.; Ma, H. W.; Shen, K. H.; Jun, D.; Li, Y. Synthesis and characterization of in-chain silyl-hydride functional SBR and self-crosslinking elastomer.Chin. Chem. Lett.2012,23, 1419−1422..

Ni, Y.; Yang, D.; Wei, Q.; Yu, L.; Ai, J.; Zhang, L. Plasticizer-induced enhanced electromechanical performance of natural rubber dielectric elastomer composites.Compos. Sci. Technol.2020,195, 108202..

Liu, J.; Fang, Z.; An, J.; Bao, C. Effect of the cross-linking of polyorganosiloxane on highly thermally conductive silicone rubber’s mechanical, dielectric, and thermally conductive properties and thermal reliability.Compos. Commun.2024,45, 101781..

Zhong, X.; He, M.; Zhang, C.; Guo, Y.; Hu, J.; Gu, J. Heterostructured BN@Co-C@C endowing polyester composites excellent thermal conductivity and microwave absorption at C band.Adv. Funct. Mater. 2024 , 2313544..

Yu, H.; Chen, C.; Sun, J.; Zhang, H.; Feng, Y.; Qin, M.; Feng, W. Highly thermally conductive polymer/graphene composites with rapid room-temperature self-healing capacity.Nano-Micro Lett.2022,14, 135..

Gong, J.; Tan, X.; Yuan, Q.; Liu, Z.; Ying, J.; Lv, L.; Yan, Q.; Chu, W.; Xue, C.; Yu, J.; Nishimura, K.; Jiang, N.; Lin, C.; Dai, W. A spiral graphene framework containing highly ordered graphene microtubes for polymer composites with superior through-plane thermal conductivity.Chin. J. Chem.2022,40, 329−336..

Yin, W.; Qin, M.; Yu, H.; Sun, J.; Feng, W. Hyperelastic graphene aerogels reinforced by in-suit welding polyimide nano fiber with leaf skeleton structure and adjustable thermal conductivity for morphology and temperature sensing.Adv. Fiber Mater. 2023 ,5, 1037–1049..

Wang, S. S.; Feng, D. Y.; Zhang, Z. M.; Liu, X.; Ruan, K. P.; Guo, Y. Q.; Gu, J. W. Highly thermally conductive polydimethylsiloxane composites with controllable 3D GO@f-CNTs networksviaself-sacrificing template method.Chinese J. Polym. Sci. 2024 ,42, 897−906..

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