Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength <italic style="font-style: italic">via</italic> a Rationally Designed Crosslinked Network for Embedded Film Capacitors

Li-Na Huang; Li Tan; Shuang-Wu Huang; Gu-Qiao Ding; Qi-Yan Zhang

doi:10.1007/s10118-026-3741-3

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Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors

RESEARCH ARTICLE | Updated：2026-07-27

- Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors
- Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors
- Chinese Journal of Polymer Science 2026年44卷第8期页码：2561-2569
- Affiliations：
  
  a.State Key Laboratory of Radio Frequency Heterogeneous Integration, College of Electronics and Information Engineering, Institute of Microelectronics (IME), Shenzhen University, Shenzhen 518060, China
  b.State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
- Author bio：
  
  zhangqy@szu.edu.cn
- Funds：
  
  This work was financially supported by the National Natural Science Foundation of China (Nos. 52573086 and 52203096), the Shenzhen Science and Technology Innovation Program (Nos. JCYJ20240813143309013 and ZDSYS20220527171402005), the Shenzhen Strategic Emerging Industry Support Plan (No. F-2023-Z99-509043), and the State Key Laboratory of Materials for Integrated Circuits (No. SKLJC-K2025-11).;The authors declare no interest conflict.Electronic supplementary information (ESI) is available free of charge in the online version of this article at http://doi.org/10.1007/s10118-026-3741-3.The data that support the findings of this study are available from the corresponding author upon reasonable request.
- DOI：10.1007/s10118-026-3741-3
  中图分类号：
- 收稿：2025-12-17，
  
  录用：2026-01-27，
  
  网络首发：2026-06-09，
  
  纸质出版：2026-08-15
- Accepted：
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Huang, L. N.; Tan, L.; Huang, S. W.; Ding, G. Q.; Zhang, Q. Y. Bismaleimide dielectric films with superior high-temperature breakdown strength via a rationally designed crosslinked network for embedded film capacitors. Chinese J. Polym. Sci. 2026, 44, 2561–2569

Li-Na Huang, Li Tan, Shuang-Wu Huang, et al. Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors[J]. Chinese Journal of Polymer Science, 2026, 44(8): 2561-2569. DOI: 10.1007/s10118-026-3741-3.
Huang, L. N.; Tan, L.; Huang, S. W.; Ding, G. Q.; Zhang, Q. Y. Bismaleimide dielectric films with superior high-temperature breakdown strength via a rationally designed crosslinked network for embedded film capacitors. Chinese J. Polym. Sci. 2026, 44, 2561–2569 DOI： 10.1007/s10118-026-3741-3.

Li-Na Huang, Li Tan, Shuang-Wu Huang, et al. Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors[J]. Chinese Journal of Polymer Science, 2026, 44(8): 2561-2569. DOI: 10.1007/s10118-026-3741-3. DOI：

摘要

A rigid-flexible network

via

bismaleimide/biphenyl epoxy co-curing enables deep charge traps and stress relief

achieving a discharged energy density of 4.59 J/cm

and 90% efficiency at 200 °C.

Abstract

The growing demand for higher operating frequencies

faster speeds

and greater power density in modern electronics has positioned embedded dielectric film capacitors as a key enabler of system miniaturization and enhanced reliability. However

such integration requires dielectric materials that exhibit both high intrinsic breakdown strength and superior high-temperature stability

a combination which is seldom achieved by conventional polymer dielectrics. In this work

we present a rationally designed rigid-flexible crosslinked network based on bismaleimide (BMI) that delivers robust performance under extreme electrical and thermal conditions. By co-curing a biphenyl epoxy (BPEP) resin with a 2

2-bis[4-(4-maleimidophenoxy)phenyl

]

propane (BMP)-based BMI matrix

a densely c

o-crosslinked network is formed. In this network

BPEP acts as a toughening agent that mitigates internal stress and inhibits micro-crack initiation

while its rigid biphenyl motifs cooperate with BMP to establish deeper charge traps

thereby effectively suppressing charge carrier excitation and transport. These synergistic mechanisms enable the optimized co-cured BMP/10%BPEP film to achieve a leakage current more than ten times lower than that of pristine BMP at 200 °C

along with a remarkable increase in breakdown strength from 509 MV/m to 615 MV/m and a rise in dielectric constant from 3.45 to 3.71. Consequently

the film exhibits an outstanding discharge energy density of 4.59 J/cm

with 90% efficiency at 200 °C

as well as excellent cycling stability over 50000 charge-discharge cycles. This study offers a feasible material design strategy for high-performance polymer dielectrics suitable for embedded capacitors in advanced electronic packaging.

关键词

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Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors

Bismaleimide Dielectric Films with Superior High-temperature Breakdown Strength via a Rationally Designed Crosslinked Network for Embedded Film Capacitors

DOI：10.1007/s10118-026-3741-3

摘要

Abstract

关键词

Keywords

references