UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation

Zi-Hua Zhang; Juan Ye; Wei-Shan Wen; Qing-Hong Luo; Hong-Ping Xiang

doi:10.1007/s10118-025-3506-4

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UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation

RESEARCH ARTICLE | Updated：2026-01-30

- UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation
- Chinese Journal of Polymer Science Vol. 44, Issue 2, Pages: 599-610(2026)
- Affiliations：
  
  a.Guangdong Provincial Key Laboratory of Functional Soft Condensed Matter, School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
  b.School of Mechanical and Electrical Engineering, Huizhou Engineering Vocational College, Huizhou 516000, China
- Author bio：
  
  xianghongping@gdut.edu.cn
- Funds：
- DOI：10.1007/s10118-025-3506-4
  CLC： [M
- Received：14 August 2025，
  
  Revised：2025-11-06，
  
  Accepted：17 November 2025，
  
  Online First：22 January 2026，
  
  Published：05 February 2026
- Accepted：
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Zhang, Z. H.; Ye, J.; Wen, W. S.; Luo, Q. H.; Xiang, H. P. UV-curable, transparent, and low volume-shrinkage silicones for efficient Mini-LED encapsulation. Chinese J. Polym. Sci. 2026, 44, 599–610

Zi-Hua Zhang, Juan Ye, Wei-Shan Wen, et al. UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation[J]. Chinese Journal of Polymer Science, 2026, 44(2): 599-610.
Zhang, Z. H.; Ye, J.; Wen, W. S.; Luo, Q. H.; Xiang, H. P. UV-curable, transparent, and low volume-shrinkage silicones for efficient Mini-LED encapsulation. Chinese J. Polym. Sci. 2026, 44, 599–610 DOI： 10.1007/s10118-025-3506-4.

Zi-Hua Zhang, Juan Ye, Wei-Shan Wen, et al. UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation[J]. Chinese Journal of Polymer Science, 2026, 44(2): 599-610. DOI： 10.1007/s10118-025-3506-4.

摘要

This work develops a novel UV-curable silicone resin containing phenyl

disulfide

and acryloyl groups. It can be rapidly UV-cured within 30 s

exhibiting a high optical transparency (>92%)

a high refractive index (>1.5)

and a low volume shrinkage (< 4.83%)

providing an effective encapsulation solution for Mini-LEDs.

Abstract

Mini light-emitting diodes (Mini-LEDs) show great application potential in high-end displays owing to their superior pixel density

brightness

responsiveness

and efficiency. However

current packaging materials for Mini-LEDs are predominantly thermally cured

which is energy- and time-consuming and can adversely affect electronic components. In this study

a novel UV-curable silicone resin containing phenyl

disulfide

and acryloyl groups (SPASR) is developed from commercially available siloxanes. The resin exhibits a refractive index (

) higher than 1.5

and it can be cured within 30 s under UV irradiation. After curing

it exhibits an optical transparency exceeding 92%

a lap adhesion st

rength of up to 1.84 MPa

and good thermostability (

265 °C). Notably

the volume shrinkage is less than 4.83%

attributed to the release of photopolymerization stress

via

UV-induced disulfide metathesis during UV curing. Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants

and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h. Consequently

these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation

offering a more reliable and efficient solution for the electronics industry.

关键词

Keywords

references

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