Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites

Zhen-Yu Wang; Tong Zhao; Shuo Meng; Xiao-Long Wang; Ying Sun; Yuan-Tao Zhang

doi:10.1007/s10118-025-3360-4

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Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites

RESEARCH ARTICLE | Updated：2025-07-26

- Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites
- Chinese Journal of Polymer Science Vol. 43, Issue 8, Pages: 1443-1457(2025)
- Affiliations：
  
  School of Electrical Engineering, Shandong University, Jinan 250061, China
- Author bio：
  
  zhaotong@sdu.edu.cn
- Funds：
- DOI：10.1007/s10118-025-3360-4
  CLC：
- Received：12 February 2025，
  
  Revised：2025-03-26，
  
  Accepted：15 April 2025，
  
  Online First：30 June 2025，
  
  Published：01 August 2025
- Accepted：
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Wang, Z. Y.; Zhao, T.; Meng, S.; Wang, X. L.; Sun, Y.; Zhang, Y. T. Key physicochemical properties and service characteristics of low dielectric polyimide-based nanocomposites. Chinese J. Polym. Sci. 2025, 43, 1443–1457

Zhen-Yu Wang, Tong Zhao, Shuo Meng, et al. Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites[J]. Chinese Journal of Polymer Science, 2025, 43(8): 1443-1457.
Wang, Z. Y.; Zhao, T.; Meng, S.; Wang, X. L.; Sun, Y.; Zhang, Y. T. Key physicochemical properties and service characteristics of low dielectric polyimide-based nanocomposites. Chinese J. Polym. Sci. 2025, 43, 1443–1457 DOI： 10.1007/s10118-025-3360-4.

Zhen-Yu Wang, Tong Zhao, Shuo Meng, et al. Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites[J]. Chinese Journal of Polymer Science, 2025, 43(8): 1443-1457. DOI： 10.1007/s10118-025-3360-4.

摘要

POSS-doped polyimide nanocomposites exhibit reduced dielectric constants (2.6)

enhanced thermal conductivity

and improved mechanical properties. Chemical bonding outperforms physical blending

offering better performance and sustainability by reducing CO emissions under high-temperature and electric field conditions.

Abstract

In high-frequency electrical energy systems

polyimide (PI) composite insulation materials need to possess a low dielectric constant

sufficient thermal conductivity

and robust interfacial adhesion to ensure reliable performance under elevated temperatures and pressures. These aspects are crucial for preventing local overheating and electrical breakdown

thereby ensuring reliable equipment operation. Traditional PI insulation materials often exhibit high dielectric constants and pronounced dielectric losses

compromising their insulation efficiency. In this study

molecular dynamics simulations were employed to incorporate polyhedral oligomeric silsesquioxanes (POSS) into PI through physical blending and chemical bonding to enhance dielectric properties. Key parameters of the PI/POSS composite system

including dielectric constant

thermal conductivity

glass transition

temperature

Young’s modulus

Poisson’s ratio

and interfacial adhesion energy

were systematically evaluated for both doping methods. The degradation behavior of the PI composites under high-temperature and electric field conditions was also simulated to elucidate degradation pathways and product distributions

providing insights for designing low-dielectric insulation materials. Doping with POSS significantly reduces the dielectric constant of PI

thereby improving insulation performance

thermal stability

mechanical strength

and interfacial adhesion. At an optimal POSS doping ratio

the thermal conductivity of PI is enhanced. Compared with the physical blending system

the chemical bonding system yields more substantial improvements across all evaluated properties. Under high-temperature and strong electric field conditions

POSS doping enhances interfacial adhesion and thermal stability

effectively suppressing the cleavage of key chemical bonds

reducing

$$ \mathrm{CO} $$

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emissions

and increasing the formation of oxygen-containing intermediates and water molecules

which contributes to improved environmental sustainability.

关键词

Keywords

references

Kausar, A. State-of-the-art of polyimide films reinforced with fullerene-design, features and applications. J. Thermoplast. Compos. Mater. 2023 , 36 , 5034−5051..

Cheng, M. Y.; Park, W. T.; Yu, A.; Xue, R. F.; Tan, K. L.; Yu, D.; Lee, S. H.; Je, M. A flexible polyimide cable for implantable neural probe arrays. Microsyst. Technol. 2013 , 19 , 1111−1118..

Ma, J.; Liu, X.; Wang, R.; Lu, C.; Wen, X.; Tu, G. Research progress and application of polyimide-based nanocomposites. Nanomaterials 2023 , 13 , 656..

Li, K.; Yang, L.; Yang, L.; He, L.; Du, J.; Li, X. Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide micro sphere. Polym. Eng. Sci. 2024 , 64 , 5166−5175..

Zhang, D.; Li, L.; Wang, Y.; Zhang, C.; Teng, C. Methods and strategies to decrease the dielectric properties of polyimide films: a review. J. Sol-Gel Sci. Technol. 2023 , 108 , 1−12..

Wang, Q.; Wang, C.; Wang, T. Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties. J. Colloid Interface Sci. 2013 , 389 , 99−105..

Li, Y.; Sun, G.; Zhou, Y.; Liu, G.; Wang, J.; Han, S. Progress in low dielectric polyimide film—a review. Prog. Org. Coat. 2022 , 172 , 107103..

Bandyopadhyay, P.; Banerjee, S. Synthesis, characterization and gas transport properties of polyamide-tethered polyhedral oligomeric silsesquioxane (POSS) nanocomposites. Ind. Eng. Chem. Res. 2014 , 53 , 18273−18282..

Huang, C.; Li, J.; Xie, G.; Han, F.; Huang, D.; Zhang, F.; Zhang, Y.; Wong, C. P. Low-dielectric constant and low-temperature curable polyimide/POSS nanocomposites. Macromol. Mater. Eng. 2019 , 304 , 1900505..

Zhang, P.; Zhao, J.; Zhang, K.; Bai, R.; Wang, Y.; Hua, C.; Wu, Y.; Liu, Y.; Zhou, H.; Li, Y. Fluorographene/polyimide composite films: Mechanical, electrical, hydrophobic, thermal and low dielectric properties. Compos. Part A Appl. Sci. Manuf. 2016 , 84 , 428−434..

Hu, K.; Ye, Q.; Fan, Y.; Nan, J.; Chen, F.; Gao, Y.; Shen, Y. Preparation and characterization of organic soluble polyimides with low dielectric constant containing trifluoromethyl for optoelectronic application. Eur. Polym. J. 2021 , 157 , 110566..

Dong, X.; Wan, B.; Zha, J. W. Versatile landscape of low- k polyimide: Theories, synthesis, synergistic properties, and industrial integration. Chem. Rev. 2024 , 124 , 10409−10475..

Simone, C. D.; Vaccaro, E.; Scola, D. A. The synthesis and characterization of highly fluorinated aromatic polyimides. J. Fluorine Chem. 2019 , 224 , 100−112..

Sawada, R.; Ando, S. Colorless, low dielectric, and optically active semialicyclic polyimides incorp orating a biobased isosorbide moiety in the main chain. Macromolecules 2022 , 55 , 6787−6800..

Cui, X.; Zheng, R. R.; Wang, J. Y.; Chen, S. W.; Yu, Y.; Guo, L. Y.; Zhou, Y.; Ruan, X. Preparation and properties of mesoporous SiO2/polyimide composite films. Polym. Compos. 2024 , 45 , 2189−2201..

Wu, Z.; Dong,J.; Li, X.; Zhao, X.; Ji, C.; Zhang, Q. Enhancing out-of-plane thermal conductivity of polyimide-based composites via the construction of inter-external dual heat conduction network by binary fillers. Compos. Part B Eng. 2023 , 266 , 111001..

Wang, T.; Wang, M.; Fu, L.; Duan, Z.; Chen, Y.; Hou, X.; Wu, Y.; Li, S.; Liang, L.; Liu, Z.; Yu, J. Enhanced thermal conductivity of polyimide composites with boron nitride nanosheets. Sci. Rep. 2018 , 8 , 1557..

Pang, Z.; Sun, H.; Guo, Y.; Du, J.; Li, L.; Li, Q.; Chen, Y.; Yang, S. Research advances of porous polyimide—based composites with low dielectric constant. Polymers 2023 , 15 , 3341..

Wei, Y.; Cheng, M.; Wang, M.; Fu, Q.; Deng, H . Polyimide/BaTiO 3 /NiNWs composites with enhanced dielectric properties. Compos. Commun. 2022 , 35 , 101286..

Huo, M.; Wang, Y.; Wang, X. Fabrication of ordered porous polyimide films templated by (AB) m type of diblock copolymer. Polymers 2023 , 15 , 635..

Xu, Y. X.; Fan, H. Z.; Zhou, Y. G. Quantifying spectral thermal transport properties in framework of molecular dynamics simulations: a comprehensive review. Rare Met. 2023 , 42 , 3914−3944..

Ivanovsky, A. S.; Garipov, I.; Kordonskaya, Y. V.; Timofeev, V. I.; Marchenkova, M. A.; Pisarevsky, Y. V.; Bondarenko, G. N.; Kovalchuk, M. V. Study of the precrystallization solution of lysozyme by accelerated molecular dynamics simulation. Crystallogr. Rep. 2023 , 68 , 947−950..

Zhang, F.; Yang, R.; Lu, D. Investigation of polymer aging mechanisms using molecular simulations: a review. Polymers 2023 , 15 , 1928..

Vidal-Limon, A.; Aguilar-Toalá, J. E.; Liceaga, A. M. Integration of molecular docking a nalysis and molecular dynamics simulations for studying food proteins and bioactive peptides. J. Agric. Food Chem. 2022 , 70 , 934−943..

Maleki, R.; Rezvantalab, S.; Shahbazi, M. A. Role of molecular simulation in the future of nanomedicine. Nanomedicine 2021 , 16 , 2133−2136..

Wu, J.; Lv, J.; Zhao, L.; Zhao, R.; Gao, T.; Xu, Q.; Zhang, Y.; Ma, F. Exploring the role of microbial proteins in controlling environmental pollutants based on molecular simulation. Sci. Total Environ . 2023 , 905 , 167028..

van Duin, A. C.; Dasgupta, S.; Lorant, F.; Goddard, W. A. ReaxFF: A reactive force field for hydrocarbons. J. Phys. Chem. A 2001 , 105 , 9396−9409..

Diao, Z.; Zhao, Y.; Chen, B.; Duan, C.; Song, S. ReaxFF reactive force field for molecular dynamics simulations of epoxy resin thermal decomposition with model compound. J. Anal. Appl. Pyrolysis 2013 , 104 , 618−624..

Pu, C.; Lin, D.; Xu, H.; Liu, F.; Gao, H.; Tian, G.; Xu, Q.; Wu, D. Clarifying the effect of chemical structure on high-te mperature resistance of polyimides based on DFT and ReaxFF based molecular dynamic simulation. Polymer 2022 , 255 , 125119..

Chen, H.; Li, L.; Zhao, W.; Zhang, X. R.; Weng, L. Corona resistance mechanism of nano-modified polyimide. Polymers 2022 , 14 , 5469..

Jin, X.; Huang, L.; Shi, Y.; Yang, S.; Hu, A. Thermosetting process and thermal degradation mechanism of high-performance polyimide. J. Anal. Appl. Pyrolysis 2002 , 64 , 395−406..

Hatori, H.; Yamada, Y.; Shiraishi, M.; Yoshihara, M.; Kimura, T. The mechanism of polyimide pyrolysis in the early stage. Carbon 1996 , 34 , 201−208..

Li, H.; Ren, D.; Cheng, X. The theoretical investigation of the β-crystobalite structure under the effect of electric field. Comput. Mater. Sci. 2015 , 96 , 306−311..

Li, Q.; Huang, X.; Xiao, Y.; Liu, T.; Wang, Z. Reactive molecular dynamics simulation of polyimide degradation under electric field conditions. High Volt. Appar. 2019 , 55 , 39−45..

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