Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene

Tian-Yong Zhang; Jia-Ning Yu; Sui-Sui Wang; Ya-Mei Chai; Shuang Jiang; Hong-Li An; Ruo-Xi Sun; Bin Li

doi:10.1007/s10118-025-3292-z

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Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene

RESEARCH ARTICLE | Updated：2025-04-29

- Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene
- Chinese Journal of Polymer Science Vol. 43, Issue 5, Pages: 863-874(2025)
- Affiliations：
  
  a.Tianjin Key Laboratory of Applied Catalysis Science and Technology, School of Chemical Engineering and Technology, Tianjin University, Tianjin 300354, China
  b.Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin 300072, China
  c.Tianjin Engineering Research Center of Functional Fine Chemicals, Tianjin 300354, China
- Author bio：
  
  shuangjiang@tju.edu.cn (S.J.)
  libin@tju.edu.cn (B.L.)
- Funds：
- DOI：10.1007/s10118-025-3292-z
  CLC：
- Received：18 November 2024，
  
  Revised：28 December 2024，
  
  Accepted：2025-01-10，
  
  Published Online：03 April 2025，
  
  Published：30 April 2025
- Accepted：
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Zhang, T. Y.; Yu, J. N.; Wang, S. S.; Chai, Y. M.; Jiang, S.; An, H. L.; Sun, R. X.; Li, B. Synthesis and properties of heat-resistant polyimides films containing crosslinkable group-tetrafluorostyrene. Chinese J. Polym. Sci. 2025, 43, 863–874

Tian-Yong Zhang, Jia-Ning Yu, Sui-Sui Wang, et al. Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene[J]. Chinese journal of polymer science, 2025, 43(5): 863-874.
Zhang, T. Y.; Yu, J. N.; Wang, S. S.; Chai, Y. M.; Jiang, S.; An, H. L.; Sun, R. X.; Li, B. Synthesis and properties of heat-resistant polyimides films containing crosslinkable group-tetrafluorostyrene. Chinese J. Polym. Sci. 2025, 43, 863–874 DOI： 10.1007/s10118-025-3292-z.

Tian-Yong Zhang, Jia-Ning Yu, Sui-Sui Wang, et al. Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene[J]. Chinese journal of polymer science, 2025, 43(5): 863-874. DOI： 10.1007/s10118-025-3292-z.

摘要

This work synthesized a novel monomer containing crosslinkable group- tetrafluorostyrene

prepared a series of polyimide films further

and improved the heat resistance of PI through thermal crosslinking. The

d5%

and

of the crosslinked PI films increased by about 40 °C compared to before crosslinking.

Abstract

Polyimide (PI) is widely used in high-tech fields such as microelectronics

aerospace

and national defense because of its excellent optical properties

high- and low-temperature resistance

and good dimensional stability. To achieve the desired properties of PI

the monomers 2

6-diaminopyrimidin-4-ol (DAPD) and 6-(2

6-tetrafluoro-4-vinylphenoxy) pyrimidin-2

4-diamine (DAFPD)

which contains crosslinkable functional groups

were designed and synthesized successfully and copolymerized with 4

4'-oxydianiline (ODA) and 4

4-hexafluoroisopropylphthalic anhydride (6FDA). The prepared PI film (PI-3)

with rigid backbones and loose packing had excellent heat resistance (

d5%

=489 °C) and optical properties (

450

=82%). Furthermore

a crosslinked PI film (c-PI-3) with more heat-resistant (

d5%

=524 °C) and better mechanical properties (

=125.46 MPa)

can be obtained through thermal crosslinking of tetrafluorostyrene. In addition

the changes in the properties caused by the proportion of DAFP

D added during copolymerization are discussed comprehensively. This study provides a promising candidate for heat-resistant PI materials.

关键词

Keywords

references

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