Side-Chain-Type Polyimide-Cu Complexes with Suppressed Activation Energy of Relaxation for Advanced High-Temperature Capacitor

Bai-Yang Zhou; Ze-Tong Ma; Shi-Long Zhong; Zhen-Jie Huang; Qi Guo; Deng-Chong Feng; Zhong-Ke Yuan; Shao-Lin Lu; Yu-Zhao Yang; Cheng Wang; Ding-Shan Yu; Xu-Dong Chen

doi:10.1007/s10118-024-3131-7

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Side-Chain-Type Polyimide-Cu Complexes with Suppressed Activation Energy of Relaxation for Advanced High-Temperature Capacitor

RESEARCH ARTICLE | Updated：2024-08-06

- Side-Chain-Type Polyimide-Cu Complexes with Suppressed Activation Energy of Relaxation for Advanced High-Temperature Capacitor
- Chinese Journal of Polymer Science Vol. 42, Issue 8, Pages: 1038-1048(2024)
- Affiliations：
  
  a.Key Laboratory for Polymeric Composite and Functional Materials of Ministry of Education, Guangdong Engineering Technology Research Centre for High Performance Organic and Polymer Photoelectric Functional Films, School of Chemistry, Sun Yat-sen University, Guangzhou 510275, China
  b.School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China
  c.Guangdong Provincial Laboratory of Chemistry and Fine Chemical Industry Jieyang Centre, Jieyang 515200, China
  d.Chemistry and Chemical Engineering Guangdong Laboratory, Shantou 515031, China
- Author bio：
  
  mazt@gdut.edu.cn (Z.T.M.)
  zhongshilong@gdut.edu.cn (S.L.Z.)
  chenxd@gdut.edu.cn (X.D.C.)
- Funds：
- DOI：10.1007/s10118-024-3131-7
  CLC：
- Received：21 January 2024，
  
  Revised：2024-03-11，
  
  Accepted：26 March 2024，
  
  Online First：17 May 2024，
  
  Published：01 August 2024
- Accepted：
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Zhou, B. Y.; Ma, Z. T.; Zhong, S. L.; Huang, Z. J.; Guo, Q.; Feng, D. C.; Yuan, Z. K.; Lu, S. L.; Yang, Y. Z.; Wang, C.; Yu, D. S.; Chen, X. D. Side-chain-type polyimide-Cu complexes with suppressed activation energy of relaxation for advanced high-temperature capacitor. Chinese J. Polym. Sci. 2024, 42, 1038–1048

Bai-Yang Zhou, Ze-Tong Ma, Shi-Long Zhong, et al. Side-Chain-Type Polyimide-Cu Complexes with Suppressed Activation Energy of Relaxation for Advanced High-Temperature Capacitor[J]. Chinese Journal of Polymer Science, 2024, 42(8): 1038-1048.
Zhou, B. Y.; Ma, Z. T.; Zhong, S. L.; Huang, Z. J.; Guo, Q.; Feng, D. C.; Yuan, Z. K.; Lu, S. L.; Yang, Y. Z.; Wang, C.; Yu, D. S.; Chen, X. D. Side-chain-type polyimide-Cu complexes with suppressed activation energy of relaxation for advanced high-temperature capacitor. Chinese J. Polym. Sci. 2024, 42, 1038–1048 DOI： 10.1007/s10118-024-3131-7.

Bai-Yang Zhou, Ze-Tong Ma, Shi-Long Zhong, et al. Side-Chain-Type Polyimide-Cu Complexes with Suppressed Activation Energy of Relaxation for Advanced High-Temperature Capacitor[J]. Chinese Journal of Polymer Science, 2024, 42(8): 1038-1048. DOI： 10.1007/s10118-024-3131-7.

摘要

A novel polyimide-Cu complex material predicated on side-chain-type pyridine-Cu coordination achieves superior dielectric performance

which endows an elevated degree of freedom with suppressed relaxation activation energy and long-range electron delocalization

enhancing molecular dipole moment with more flexibility.

Abstract

The burgeoning growth of the new energy vehicles and aviation industry has escalated the need for energy storage capacitors capable of stable operation in harsh environments. The advent of metal-polyimide complexes has illuminated a novel approach for preparing temperature-resistant capacitors. However

the general application of these metal-polyimide complexes is impeded by the high dielectric loss and low breakdown strength

consequences of main-chain coordination and excessive metal ions content. Herein

our study proposes a novel polyimide-Cu complex material (POP-Cu) predicated on side-chain-type pyridine-Cu coordination

utilizing the structural backbone PMDA-ODA of mature commercial PI (Kapton) with reliable performance. Owing to the high degree of freedom afforded by the side chain with suppressed relaxation activation energy and the long-range electron delocalization formed by

coordination

the dielectric constant of this material containing merely 2.7 mol

% Cu increases from 3.25 (POPI) to 5.58

while maintaining a remarkably low dielectric loss of 0.0066. Meanwhile

this material exhibits a substantial DC breakdown strength of 436.2 MV·m

−1

and a high energy density of 5.42 J·cm

−3

coupled with superior mechanical and thermal properties. Even at 150 °C

it retains over 90% of its room-temperature energy density

demonstrating notable dielectric stability under high temperatures. These attributes underscore its promising application for capacitors operating in harsh environments.

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