Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane

Xiu-Ting Li; Xiao-Meng Zhu; Jie Dong; Xin Zhao; Qing-Hua Zhang

doi:10.1007/s10118-021-2585-0

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Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane

ARTICLE | Updated：2021-06-18

- Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane
- Chinese Journal of Polymer Science Vol. 39, Issue 9, Pages: 1200-1210(2021)
- Affiliations：
  
  State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
- Author bio：
  
  qhzhang@dhu.edu.cn
- Funds：
- DOI：10.1007/s10118-021-2585-0
  CLC：
- Received：05 January 2021，
  
  Revised：2021-3-24，
  
  Accepted：30 March 2021，
  
  Online First：18 June 2021，
  
  Published：18 July 2021
- Accepted：
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Li, X. T.; Zhu, X. M.; Dong, J.; Zhao, X.; Zhang, Q. H. Preparation of low-dielectric permittivity polyimide resins with high surface activity from chemically bonded hyperbranched polysiloxane. Chinese J. Polym. Sci. 2021, 39, 1200–1210

Xiu-Ting Li, Xiao-Meng Zhu, Jie Dong, et al. Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane[J]. Chinese Journal of Polymer Science, 2021, 39(9): 1200-1210.
Li, X. T.; Zhu, X. M.; Dong, J.; Zhao, X.; Zhang, Q. H. Preparation of low-dielectric permittivity polyimide resins with high surface activity from chemically bonded hyperbranched polysiloxane. Chinese J. Polym. Sci. 2021, 39, 1200–1210 DOI： 10.1007/s10118-021-2585-0.

Xiu-Ting Li, Xiao-Meng Zhu, Jie Dong, et al. Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane[J]. Chinese Journal of Polymer Science, 2021, 39(9): 1200-1210. DOI： 10.1007/s10118-021-2585-0.

摘要

Abstract

Thermosetting resin matrix is the key component of advanced wave-transparent composites

where low dielectric constant

excellent processability

high thermal stability

as well as good bonding ability are required for resins. Herein

we prepared a series of phenylethynyl terminated polyimide (PI) resins by grafting amine-functionalized hyperbranched polysiloxane (HBPSi) to PI chains during the

in situ

polymerization. The effects of HBPSi on the processability of oligomers

molecular packing

thermal stability

dielectric property and bonding ability to reinforce Kevlar fibers of the cured PI/HBPSi composite resins have been examined in detail. The dielectric constants of the cured composite resins were greatly reduced from 3.29 to 2.19 without compromising its processability and thermal stability. Meanwhile

the 10 wt% HBPSi-containing PI resin demonstrated better bonding ability to reinforce fibers with the interfacial shear strength (IFSS) of 37.64 MPa

compared with that of neat PI-6 matrix (27.34 MPa)

and better adhesion to metal with the lap shear strength of 10.48 MPa

50% higher than that of neat resin PI-6 (6.98 MPa). These resultant PI/HBPSi composite resins exhibit excellent comprehensive properties

indicating their great potential as low-dielectric constant resin matrix in radar radome.

关键词

Keywords

references

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