The In-plane Orientation and Thermal Mechanical Properties of the Chemically Imidized Polyimide Films

Zhen-He Wang; Xing Chen; Hai-Xia Yang; Jiang Zhao; Shi-Yong Yang

doi:10.1007/s10118-019-2173-8

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The In-plane Orientation and Thermal Mechanical Properties of the Chemically Imidized Polyimide Films

ARTICLE | Updated：2021-02-18

- The In-plane Orientation and Thermal Mechanical Properties of the Chemically Imidized Polyimide Films
- Chinese Journal of Polymer Science Vol. 37, Issue 3, Pages: 268-278(2019)
- Affiliations：
  
  a.Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  b.State Key Laboratory of Polymer Physics and Chemistry, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  c.University of Chinese Academy of Science, Beijing 100049, China
  d.Department of Polymer Science, The University of Akron, Akron, Ohio 44325-3909, USA
- Author bio：
  
  yanghx@iccas.ac.cn (H.X.Y.)
  shiyang@iccas.ac.cn (S.Y.Y.)
- Funds：
- DOI：10.1007/s10118-019-2173-8
  CLC：
- Received：11 August 2018，
  
  Revised：2018-9-9，
  
  Accepted：18 September 2018，
  
  Online First：22 October 2018，
  
  Published：2019-03
- Accepted：
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Citation: Wang, Z. H.; Chen, X.; Yang, H. X.; Zhao, J.; Yang, S. Y. The in-plane orientation and thermal mechanical properties of the chemically imidized polyimide films. Chinese J. Polym. Sci. 2019, 37, 268–278

Zhen-He Wang, Xing Chen, Hai-Xia Yang, et al. The In-plane Orientation and Thermal Mechanical Properties of the Chemically Imidized Polyimide Films[J]. Chinese Journal of Polymer Science, 2019, 37(3): 268-278.
Citation: Wang, Z. H.; Chen, X.; Yang, H. X.; Zhao, J.; Yang, S. Y. The in-plane orientation and thermal mechanical properties of the chemically imidized polyimide films. Chinese J. Polym. Sci. 2019, 37, 268–278 DOI： 10.1007/s10118-019-2173-8.

Zhen-He Wang, Xing Chen, Hai-Xia Yang, et al. The In-plane Orientation and Thermal Mechanical Properties of the Chemically Imidized Polyimide Films[J]. Chinese Journal of Polymer Science, 2019, 37(3): 268-278. DOI： 10.1007/s10118-019-2173-8.

摘要

Abstract

The thermal and mechanical properties of the chemically imidized polyimide (CIPI) films and thermally imidized polyimide (TIPI) films were investigated systematically. Experimental results indicated that the CIPI films show dramatically enhanced tensile strength and modulus with obviously reduced coefficient of thermal expansion (CTE) in comparison with TIPI films. These enhancements results from the high in-plane orientation and close packing of the CIPI backbones. Compared with thermal imidization which starts at about 140 °C

the chemical imidization activated by acetic anhydride and isoquinoline initiates the cyclization even at room temperature. The resulting imide rings restrict the mobility of polymer chains and lead to the in-plane orientation with solvent evaporation. Additionally

fewer small molecules remain in the films after treated at 120 °C by chemical imidization than by thermal imidization. The polymer chain plasticization caused by the evaporation of small molecules at high temperature is obviously restricted. Moreover

the partially imidized polymer inhibits the decomposition of mainchains that occurs at subsequent high temperature process

being beneficial to the formation of high molecular weight PI films. Hence

chemical imidization pathway shows apparent advantage to produce PI films with great combined properties

including high modulus

strength and toughness

as well as high thermal dimension stability

etc

关键词

Keywords

references

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