Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties

Xiao-yan Wei; Bo-xuan Zhao; Ya-zhuo Shang; Yuan-rong Cheng

doi:10.1007/s10118-017-1975-9

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Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties

Papers | Updated：2021-02-18

- Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties
- Chinese Journal of Polymer Science Vol. 35, Issue 11, Pages: 1428-1435(2017)
- Affiliations：
  
  a.Key Laboratory for Advanced Materials, School of Chemistry & Molecular Engineering, East China University of Science and Technology, Shanghai 200237, China
  b.Shanghai Wujing Optoelectronics Sci & Tech Co., Ltd, Shanghai 200093, China
  c.Department of Materials Science, Fudan University, Shanghai 200433, China
- Author bio：
  
  Ya-zhuo Shang(尚亚卓), E-mail:shangyazhuo@ecust.edu.cn
  Yuan-rong Cheng(程元荣), E-mail:chengyr@fudan.edu.cn
- Funds：
- DOI：10.1007/s10118-017-1975-9
  CLC：
- Received：11 March 2017，
  
  Revised：2017-4-25，
  
  Accepted：08 May 2017，
  
  Published：05 November 2017
- Accepted：
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Xiao-yan Wei, Bo-xuan Zhao, Ya-zhuo Shang, et al. Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties[J]. Chinese Journal of Polymer Science, 2017, 35(11): 1428-1435.
DOI：

Xiao-yan Wei, Bo-xuan Zhao, Ya-zhuo Shang, et al. Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties[J]. Chinese Journal of Polymer Science, 2017, 35(11): 1428-1435. DOI： 10.1007/s10118-017-1975-9.

摘要

Abstract

Biphenyl-contained monomer of 1

4-bis[2-(3

4-epoxy cyclohexyl ethyl) dimethylsilyl] biphenyl (BP-SiH-EP) was prepared

via

hydrosilylation reaction of 1

4-bis(dimethylsilyl) biphenyl (BP-SiH) and 1

2-epoxy-4-vinylcyclohexane in the presence of Karstedt's catalyst.

H-NMR

C-NMR and FTIR were used to characterize the structure of the obtained monomer. BP-SiH-EP was then cured by methyl hexahydrophthalic anhydride (MeHHPA) with 1-cyanoethyl-2-ethyl-4-methylimidazole as an accelerator. The polymerization behavior was studied by DSC. The results of DMA measurement demonstrate that the cured BP-SiH-EP/MeHHPA can maintain high storage modulus (

1 GPa) in a wide range of temperature up to 176℃. According to the damping factor curve of DMA

cured BP-SiH-EP/MeHHPA exhibits a high glass transition temperature (

) of 192℃

which is 20℃ higher than that of cured 1

4-bis[2-(3

4-epoxy cyclohexyl ethyl) dimethylsilyl] benzene (DEDSB)/MeHHPA. TGA results show that cured BP-SiH-EP/MeHHPA has good thermal stability (

=339℃) due to the high heat-resistance of rigid biphenyl group. Moreover

the crosslinking density of cured BP-SiH-EP/MeHHPA should be lower than that of cured DEDSB/MeHHPA estimated from their chemical structures

which conflicts with the calculated results based on the rubber elasticity equation. The inconsistence indicates that the calculated crosslinking densities are not comparable

possibly owing to their differences in the rigidity of polymer chains and intermolecular interaction.

关键词

Keywords

references

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