High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities

Wei Chen; Mian Ji; Shi-yong Yang

doi:10.1007/s10118-016-1813-5

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High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities

PAPERS | Updated：2021-05-12

- High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities
- Chinese Journal of Polymer Science Vol. 34, Issue 8, Pages: 933-948(2016)
- Affiliations：
  
  a. Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  b. University of Chinese Academy of Sciences, Beijing 100049, China
- Author bio：
  
  Shi-yong Yang (杨士勇), E-mail: shiyang@iccas.ac.cn
- Funds：
- DOI：10.1007/s10118-016-1813-5
  CLC：
- Received：07 February 2016，
  
  Revised：2016-4-3，
  
  Accepted：06 April 2016，
  
  Published：2016-08
- Accepted：
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Wei Chen, Mian Ji, Shi-yong Yang. High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities[J]. Chinese Journal of Polymer Science, 2016, 34(8): 933-948.
DOI：

Wei Chen, Mian Ji, Shi-yong Yang. High Thermal Stable Polyimide Resins Derived from Phenylethynylendcapped Fluorenyl Oligoimides with Low Melt Viscosities[J]. Chinese Journal of Polymer Science, 2016, 34(8): 933-948. DOI： 10.1007/s10118-016-1813-5.

摘要

Abstract

To improve the processability and thermal stability of polyimide

a series of novel phenylethynyl-endcapped oligoimides (PEPA-oligoimides) with calculated molecular weights (

C) were successfully prepared from thermal imidization of 4

4'-(9-fluorenylidene) dianiline (BAFL) as fluorenyl diamine

4'-oxy-diphthalic anhydride (ODPA) as aromatic dianhydride and 4-phenylethynylphthalic anhydride (4-PEPA) acted as reactive end-capping reagent at elevated temperatures. Experiment results indicated that the oligoimides were the mixtures of PEPA-endcapped oligomers with different degrees of polymerization characterized by MALDI-TOF mass spectra. The influence of chemical structures on the melt processabilities of the oligoimides

the thermal

dielectric and mechanical properties of the thermoset resins was studied. The typical oligoimide resin owned minimum melt viscosity of 0.2 Pa·s at around 310℃ and wide melting processing window

suitable for resin transfer molding (RTM). Besides

its corresponding thermal-cured polyimide resin possessed glass transition temperature (

) as high as 514℃. The dielectric constants of polyimide resins decreased from 3.15 to 2.80 by reducing the

C. The mechanical properties of the polyimide neat resins were improved gradually with increasing

C. Finally

the carbon fiber/polyimide (C

/PI) composite laminates showed excellent mechanical strength retention rate at 350℃

might be long-term served at extremely high temperature in aerospace and aviation field.

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references

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