

FOLLOWUS
Shanghai Key Laboratory of Advanced Polymeric Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China
Yu Lin (林宇), E-mail: linyu@ecust.edu.cn
Guo-zhang Wu (吴国章), E-mail: wgz@ecust.edu.cn
Received:28 October 2015,
Revised:2015-12-19,
Accepted:22 December 2015,
Published:2016-05
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Jing-jing Shen, Dong-ge Zhang, Xing Liu, et al. Facile Fabrication of High-performance Polyimide Nanocomposites with
Polyimide/carbon black (PI/CB) nanocomposite films were fabricated
via
the direct ball-milling method with poly(amic acid) (PAA)
the precursor of PI
as an
in situ
formed impurity-free dispersant. FTIR and Raman spectral results reveal that
besides physical adsorption
chemical grafting of PAA chains onto the CB surface occurs during the ball-milling process. Comparative studies show that introduction of various commercial dispersants improves the dispersion of CB. However
the mixtures exhibit poor reproducibility
unstable electrical properties
and decreased tensile strength; these issues may be attributed to interfacial pollution brought about by differences in the chemical structures of the dispersant and the matrix. The impurity-free dispersant is effective not only in ensuring the uniform dispersion of CB particles but also in enhancing filler-matrix interfacial adhesion. High-molecular weight PAA chains are effective reagents for impurity-free modification and can therefore be used to improve the electrical and mechanical properties of the resultant composite.
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