Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites

Yuan-Kai Du; Zheng-Xue Shi; Shan Dong; Hui Jin; Xue Ke; Pei Zhao; Bing-Bing Jiang; Feng You

doi:10.1007/s10118-023-3057-5

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Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites

REVIEW | Updated：2024-02-20

- Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites
  Enhanced Publication
- Chinese Journal of Polymer Science Vol. 42, Issue 3, Pages: 277-291(2024)
- Affiliations：
  
  a.Hubei Key Laboratory of Plasma Chemistry and Advanced Materials, School of Material Science and Engineering, Wuhan Institute of Technology, Wuhan 430205, China
  b.Key Laboratory of Green Preparation and Application of Functional Materials, Ministry of Education, Hubei University, Wuhan 430062, China
  c.Institute of Molecular Aggregation Science, Tianjin University, Tianjin 300072, China
- Author bio：
  
  youfeng.mse@wit.edu.cn
- Funds：
- DOI：10.1007/s10118-023-3057-5
  CLC：
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Du, Y. K.; Shi, Z. X.; Dong, S.; Jin, H.; Ke, X.; Zhao, P.; Jiang, B. B.; You, F. Recent progress in fabrication and structural design of thermal conductive polymer composites. Chinese J. Polym. Sci. 2024, 42, 277–291

Yuan-Kai Du, Zheng-Xue Shi, Shan Dong, et al. Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites. [J]. Chinese Journal of Polymer Science 42(3):277-291(2024)
Du, Y. K.; Shi, Z. X.; Dong, S.; Jin, H.; Ke, X.; Zhao, P.; Jiang, B. B.; You, F. Recent progress in fabrication and structural design of thermal conductive polymer composites. Chinese J. Polym. Sci. 2024, 42, 277–291 DOI： 10.1007/s10118-023-3057-5.

Yuan-Kai Du, Zheng-Xue Shi, Shan Dong, et al. Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites. [J]. Chinese Journal of Polymer Science 42(3):277-291(2024) DOI： 10.1007/s10118-023-3057-5.

摘要

The progress of design fabrication and performance of thermal conductive polymer composites was reviewed in three directions in this work, including the introduction of single filler, hybrid fillers and complex multiphase structures.

Abstract

In recent years, the demand direction for electronic equipment has expanded into embedded and miniaturized devices. The heat radiation problem has become one of the most significant factors for hindering the development of electronic devices. Since heat radiation material is one of the important components in electronic devices, the demand for enhancing thermal conductivity is also increasingly urgent. Research on thermal conductive polymer composites has become a major direction for developing functional composites. This work reviewed the recent progress in the fabrication of thermal conductive polymer composites. Five different structures are presented, including the using of single fillers, hybrid fillers, double threshold percolation structure, segregated structure and other complex multiphase structures. Specifically, the preparation of high-performance thermal conductive polymer composites was introduced through the combination of various thermal conductive fillers. Finally, the development direction of high thermal conductive polymer composites was briefly explored.

关键词

Keywords

Thermal conductive polymerHybrid fillersPolymer compositeThermal resistance

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