On-demand Peelable UV-curable Adhesives with Superior Bonding Strength: Rational Molecular Engineering of Cohesion-adhesion Synergy

Wen-Qian Liu; Peng Wang; Hao-Kai Yuan; Lin Zhang; Bin Chen; Hong-Fei Jiang; Yi-Ran Wang; Lu Wang; Shu-Sheng Li; Chuan-Yong Zong

doi:10.1007/s10118-026-3677-7

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On-demand Peelable UV-curable Adhesives with Superior Bonding Strength: Rational Molecular Engineering of Cohesion-adhesion Synergy

RESEARCH ARTICLE | Updated：2026-08-31

- On-demand Peelable UV-curable Adhesives with Superior Bonding Strength: Rational Molecular Engineering of Cohesion-adhesion Synergy
- Chinese Journal of Polymer Science Vol. 44, Issue 9, Pages: 3053-3065(2026)
- Affiliations：
  
  a.School of Chemistry and Chemical Engineering, Shandong Provincial Key Laboratory of Extreme Environment-tolerant Specialty Chemicals, University of Jinan, Jinan 250022, China
  b.Shandong Institute of Non-Metallic Materials, Jinan 250031, China
  c.School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China
- Author bio：
  
  chm_zongcy@ujn.edu.cn
- Funds：
- DOI：10.1007/s10118-026-3677-7
  CLC：
- Received：06 February 2026，
  
  Accepted：18 March 2026，
  
  Online First：08 June 2026，
  
  Published：05 September 2026
- Accepted：
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Liu, W. Q.; Wang, P.; Yuan, H. K.; Zhang, L.; Chen, B.; Jiang, H. F.; Wang, Y. R.; Wang, L.; Li, S. S.; Zong, C. Y. On-demand peelable UV-curable adhesives with superior bonding strength: rational molecular engineering of cohesion-adhesion synergy. Chinese J. Polym. Sci. 2026, 44, 3053–3065

Wen-Qian Liu, Peng Wang, Hao-Kai Yuan, et al. On-demand Peelable UV-curable Adhesives with Superior Bonding Strength: Rational Molecular Engineering of Cohesion-adhesion Synergy[J]. Chinese Journal of Polymer Science, 2026, 44(9): 3053-3065.
Liu, W. Q.; Wang, P.; Yuan, H. K.; Zhang, L.; Chen, B.; Jiang, H. F.; Wang, Y. R.; Wang, L.; Li, S. S.; Zong, C. Y. On-demand peelable UV-curable adhesives with superior bonding strength: rational molecular engineering of cohesion-adhesion synergy. Chinese J. Polym. Sci. 2026, 44, 3053–3065 DOI： 10.1007/s10118-026-3677-7.

Wen-Qian Liu, Peng Wang, Hao-Kai Yuan, et al. On-demand Peelable UV-curable Adhesives with Superior Bonding Strength: Rational Molecular Engineering of Cohesion-adhesion Synergy[J]. Chinese Journal of Polymer Science, 2026, 44(9): 3053-3065. DOI： 10.1007/s10118-026-3677-7.

摘要

This study reports on-demand peelable UV-curable adhesives with outstanding bonding strength

hot-water-triggered debonding

and recyclable adhesion

which show great promise for electronic device recycling and sustainable manufacturing.

Abstract

On-demand peelable adhesives represent a pivotal green chemistry research avenue; however

they confront a critical challenge in reconciling robust interfacial bonding strength with efficient peelability. Herein

a cohesion-adhesion synergy-guided molecular engineering strategy was developed to fabricate UV-curable adhesives with the integrated properties of superior bonding strength and hot water-triggered peelability. The adhesive was formulated with custom-synthesized difunctional polyurethane acrylate (PM1) as the crosslinker

which was blended with complementary acrylate monomers. PM1 constructed a robust yet adaptable crosslinking network to ensure high cohesive strength; its polytetrahydrofuran diol- and polyester diol-derived soft segments endowed the network with superior molecular chain mobility and stress dissipation capacity. Additionally

the incorporation and compositional optimization of polar acrylate monomers modulate the cohesive energy

surface wettability

and interfacial adhesion of the substrate

thus realizing synergistic enhancement of the cohesive and adhesive properties. Systematic experimental investigations and molecular dynamics simulations were conducted to determine the structure-property relationships governing the composition

bonding performance

and mechanical properties of UV-curable adhesives. The optimized formulation achieved high shear strength (>5 MPa

glass substrates)

excellent mechanical properties (tensile strength: 12.80 MPa

elongation at break: 313.70%)

and good thermal stability (5 wt% weight-loss temperature > 240 °C). Notably

the developed adhesives realize rapid

complete

and residue-free debonding within 3 min of immersion in 60 °C water

where hydration-induced disruption of adhesive-substrate contact attenuates interfacial interactions. Additionally

the peeled adhesive can be recycled repeatedly after drying while retaining its excellent interfacial bonding performance. This study provides a versatile and scalable strategy for the rational design of high-performance functional adhesives

thereby paving the way for recycling electronic products and sustainable manufacturing.

关键词

Keywords

references

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