Erratum to “Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips”

Wei Tian; Xin-Yuan Wang; Die-Wen Feng; Xiang-Qian Li; Yue-Kang Jin; Hui Li; Hao Liu

doi:10.1007/s10118-025-3480-x

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Erratum to “Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips”

ERRATUM | Updated：2026-01-13

- Erratum to “Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips”
- Chinese Journal of Polymer Science Vol. 44, Issue 1, Pages: 314(2026)
- Affiliations：
  
  a.State Key Laboratory of Advanced Fiber Materials, Center for Advanced Low-Dimension Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
  b.Salus BioMed Company, Shenzhen 518106, China
  c.Institute of Advanced Technology, University of Science and Technology of China, Hefei 230026, China
- Author bio：
  
  jinyk@mail.ustc.edu.cn (Y.K.J.)
  lihui@dhu.edu.cn (H.L.)
  liuh@dhu.edu.cn (H.L.)
- Funds：
- DOI：10.1007/s10118-025-3480-x
  CLC：
- Published：15 January 2026
- Accepted：
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Tian, W.; Wang, X. Y.; Feng, D. W.; Li, X. Q.; Jin, Y. K.; Li, H.; Liu, H. Erratum to “amine-reactive polymer platform for engineering surface modification of next-generation sequencing chips”. Chinese J. Polym. Sci. 2026, 44, 314

Wei Tian, Xin-Yuan Wang, Die-Wen Feng, et al. Erratum to “Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips”[J]. Chinese Journal of Polymer Science, 2026, 44(1): 314.
Tian, W.; Wang, X. Y.; Feng, D. W.; Li, X. Q.; Jin, Y. K.; Li, H.; Liu, H. Erratum to “amine-reactive polymer platform for engineering surface modification of next-generation sequencing chips”. Chinese J. Polym. Sci. 2026, 44, 314 DOI： 10.1007/s10118-025-3480-x.

Wei Tian, Xin-Yuan Wang, Die-Wen Feng, et al. Erratum to “Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips”[J]. Chinese Journal of Polymer Science, 2026, 44(1): 314. DOI： 10.1007/s10118-025-3480-x.

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