Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management

Bo-Wen Wang; Heng Zhang; Qing-Xia He; Hui-Tao Yu; Meng-Meng Qin; Wei Feng

doi:10.1007/s10118-024-3159-8

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Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management

RESEARCH ARTICLE | Updated：2024-06-26

- Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management
  Enhanced Publication
- Chinese Journal of Polymer Science Vol. 42, Issue 7, Pages: 1002-1014(2024)
- Affiliations：
  
  a.Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China
  b.International Engineering Institute, Tianjin University, Tianjin 300350, China
- Author bio：
  
  qmm@tju.edu.cn (M.M.Q.)
  weifeng@tju.edu.cn (W.F.)
- Funds：
- DOI：10.1007/s10118-024-3159-8
  CLC：
- Received：09 April 2024，
  
  Revised：2024-05-05，
  
  Accepted：08 May 2024，
  
  Online First：23 May 2024，
  
  Published：01 July 2024
- Accepted：
Scan QR Code
Wang, B. W.; Zhang, H.; He, Q. X.; Yu, H. T.; Qin, M. M.; Feng, W. Corrugated graphene paper reinforced silicone resin composite for efficient interface thermal management. Chinese J. Polym. Sci. 2024, 42, 1002–1014

Bo-Wen Wang, Heng Zhang, Qing-Xia He, et al. Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management[J]. Chinese Journal of Polymer Science, 2024, 42(7): 1002-1014.
Wang, B. W.; Zhang, H.; He, Q. X.; Yu, H. T.; Qin, M. M.; Feng, W. Corrugated graphene paper reinforced silicone resin composite for efficient interface thermal management. Chinese J. Polym. Sci. 2024, 42, 1002–1014 DOI： 10.1007/s10118-024-3159-8.

Bo-Wen Wang, Heng Zhang, Qing-Xia He, et al. Corrugated Graphene Paper Reinforced Silicone Resin Composite for Efficient Interface Thermal Management[J]. Chinese Journal of Polymer Science, 2024, 42(7): 1002-1014. DOI： 10.1007/s10118-024-3159-8.

摘要

Graphene paper with a special corrugated structure was prepared by a simple hot-pressing process. The interface interaction between the graphene paper framework and polymer matrix was enhanced. This corrugated structure composite material possesses tunability

allowing for customized design and fabrication according to specific requirements.

Abstract

With

the rapid development of high-power-density electronic devices

interface thermal resistance has become a critical barrier for effective heat management in high-performance electronic products. Therefore

there is an urgent demand for advanced thermal interface materials (TIMs) with high cross-plane thermal conductivity and excellent compressibility to withstand increasingly complex operating conditions. To achieve this aim

a promising strategy involves vertically arranging highly thermoconductive graphene on polymers. However

with the currently available methods

achieving a balance between low interfacial thermal resistance

bidirectional high thermal conductivity

and large-scale production is challenging. Herein

we prepared a graphene framework with continuous filler structures in in-plane and cross-plane directions by bonding corrugated graphene to planar graphene paper. The interface interaction between the graphene paper framework and polymer matrix was enhanced

via

surface functionalization to reduce the interface thermal resistance. The resulting three-dimensional thermal framework endows the polymer composite material with a cross-plane thermal conductivity of 14.4 W·m

−1

·K

−1

and in-plane thermal conductivity of 130 W·m

−1

·K

−1

when the thermal filler loading is 10.1 wt%

with a thermal conductivity enhancement per 1 wt% filler loading of 831%

outperforming various graphene structures as fillers. Given its high thermal conductivity

low contact thermal resistance

and low compressive modulus

the developed highly thermoconductive composite material demonstrates superior performance in TIM testing compared with TFLEX-700

an advanced commercial TIM

effectively solving the interfacial heat transfer issues in electronic systems. This novel filler structure framework also provides a solution for achieving a balance between efficient thermal management and ease of processing.

关键词

Keywords

references

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